Flexible printed circuit board and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9980386-B1
Application number	US-201715795198-A
Country	US
Kind code	B1
Filing date	Oct 26, 2017
Priority date	Sep 28, 2017
Publication date	May 22, 2018
Grant date	May 22, 2018

Abstract

A method for manufacturing a flexible printed circuit board includes providing a first double-sided circuit substrate which comprises an electronic component. A multilayer circuit substrate having a mounting groove is also provided. The multilayer circuit substrate covers the first double-sided circuit substrate through an adhesive layer, causing the electronic component to be received in the mounting groove, thereby forming an intermediate product. At least one through hole is defined in the intermediate product, which when filled with conductive material electrically connects the multilayer circuit substrate to the first double-sided circuit substrate to form the flexible printed circuit board.

First claim

What is claimed is:

1. A method for manufacturing a flexible printed circuit board comprising:
providing a first double-sided circuit substrate which comprises an electronic component, wherein the first double-sided circuit substrate further comprises a first base layer, two first conductive wiring layers formed on two opposite surfaces of the first base layer, and a first isolated layer formed on one surface of each first conductive wiring layer facing away from the first base layer, one of the first conductive wiring layers being exposed from the first isolated layer to form at least one pad, the electronic component is electrically connected to the pad;
providing a multilayer circuit substrate and defining a mounting groove in the multilayer circuit substrate, wherein multilayer circuit substrate comprises a second double-sided circuit substrate, the second double-sided circuit substrate comprises a second base layer and two second conductive wiring layers formed on two opposite surfaces of the second base layer, the multilayer circuit substrate further comprises at least one circuit substrate formed on each surface of the second double-sided circuit substrate through a build-up process, each circuit substrate comprises a second isolated layer formed on the surface of the second double-sided circuit substrate through an adhesive layer and a third conductive wiring layer formed on the second isolated layer, the mounting groove passes through each third conductive wiring layer, each second isolated layer, the adhesive layer, and the second double-sided circuit substrate, the circuit substrate defines at least one blind hole, for electrically connecting each third conductive wiring layer to the second conductive wiring layer when forming conductive material on an inner wall of the blind hole;
attaching the multilayer circuit substrate to the first double-sided circuit substrate through an adhesive layer, causing the electronic component to be received in the mounting groove, thereby forming an intermediate product; and
forming at least one conductive post in the intermediate product which electrically connects the multilayer circuit substrate to the first double-sided circuit substrate, thereby forming the flexible printed circuit board.

2. The method of claim 1 , wherein each pad is protected by surface treatment to form a protection layer on the pad.

3. The method of claim 1 , wherein the first base layer is made of a polymer selected from a group consisting of polyimide, liquid crystal polymer, polytetrafluoroethylene, poly thiamine, poly (methyl methacrylate), polycarbonate, polyethylene terephthalate, polyimide-polyethylene terephthalate, and any combination thereof.

4. The method of claim 1 , wherein the step of forming at least one conductive post in the intermediate product further comprises:
defining at least one through hole in the intermediate product, each through hole passing through the multilayer circuit substrate, the adhesive layer, and the double-sided circuit substrate; and
filling conductive material in each through hole to form the conductive post.

5. The method of claim 4 , further comprising:
forming a solder mask layer on each end of each conductive post.

6. The method of claim 4 , wherein the conductive material is conductive paste.

7. A flexible printed circuit board comprising:
a first double-sided circuit substrate which comprises an electronic component, wherein the first double-sided circuit substrate further comprises a first base layer, two first conductive wiring layers formed on two opposite surfaces of the first base layer, and a first isolated layer formed on one surface of each first conductive wiring layer facing away from the first base layer, one of the first conductive wiring layers is exposed from the first isolated layer to form at least one pad, the electronic component is electrically connected to the pad;
an adhesive layer; and
a multilayer circuit substrate attached to the first double-sided circuit substrate through the adhesive layer, the multilayer circuit substrate defining a mounting groove, the electronic component received in the mounting groove, the multilayer circuit substrate, the adhesive, and the first double-sided circuit substrate forming at least one conductive post, each conductive post electrically connecting the multilayer circuit substrate to the first double-sided circuit substrate;
wherein the multilayer circuit substrate comprises a second double-sided circuit substrate; the second double-sided circuit substrate comprises a second base layer and two second conductive wiring layers formed on two opposite surfaces of the second base layer; the multilayer circuit substrate further comprises at least one circuit substrate formed on each surface of the second double-sided circuit substrate through a build-up process, each circuit substrate comprises a second isolated layer formed on the surface of the second double-sided circuit substrate through an adhesive layer and a third conductive wiring layer formed on the second isolated layer; the mounting groove passes through each third conductive wiring layer, each second isolated layer, the adhesive layer, and the second double-sided circuit substrate; the circuit substrate defines at least one blind hole, for electrically connecting each third conductive wiring layer to the second conductive wiring layer when forming conductive material on an inner wall of the blind hole.

8. The flexible printed circuit board of claim 7 , wherein each pad is protected by surface treatment to form a protection layer on the pad.

9. The flexible printed circuit board of claim 7 , wherein the first base layer is made of a polymer selected from a group consisting of polyimide, liquid crystal polymer, polytetrafluoroethylene, poly thiamine, poly (methyl methacrylate), polycarbonate, polyethylene terephthalate, polyimide-polyethylene terephthalate, and any combination thereof.

10. The flexible printed circuit board of claim 7 , wherein a solder mask layer is formed on each end of each conductive post.

11. The flexible printed circuit board of claim 7 , wherein the conductive material is conductive paste.

Assignees

• Hongqisheng Prec Electronics Qinhuangdao Co Ltd
• Avary Holding Shenzhen Co Ltd
• Hongqisheng Prec Electronics Qinhuangdao Co

Inventors

• Li yan-lu
• Wang jun-hua

Classifications

• H05K3/462

  characterized by laminating only or mainly similar double-sided circuit boards · CPC title

• H05K3/4697 Primary

  having cavities, e.g. for mounting components (H05K3/4691 takes precedence) · CPC title

• H05K1/183 Primary

  associated with components mounted in and supported by recessed areas of the PCBs · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K3/4069

  for via connections in organic insulating substrates · CPC title