Printed circuit board and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-2016081191-A1
Application number	US-201514733245-A
Country	US
Kind code	A1
Filing date	Jun 8, 2015
Priority date	Sep 16, 2014
Publication date	Mar 17, 2016
Grant date	—

Abstract

A printed circuit board and a manufacturing method thereof are disclosed. The printed circuit board in accordance with an aspect of the present invention includes: a base board having a pad formed on one surface thereof; a copper clad laminate laminated on the one surface of the base board and having a cavity formed therein such that the pad is placed within the cavity; and an insulating adhesive layer interposed between the base board and the copper clad laminate in such a way that the pad is exposed

First claim

What is claimed is:

1 . A printed circuit board comprising:
a base board having a pad formed on one surface thereof; a copper clad laminate laminated on the one surface of the base board and having a cavity formed therein such that the pad is placed within the cavity; and an insulating adhesive layer interposed between the base board and the copper clad laminate in such a way that the pad is exposed.

2 . The printed circuit board of claim 1 , wherein the insulating adhesive layer is laminated on the one surface of the base board having the pad formed thereon and is formed to have a portion thereof corresponding to the pad removed to allow the pad to be exposed.

3 . The printed circuit board of claim 2 , further comprising a via hole integrally penetrating the base board and the copper clad laminate and allowing the base board and the copper clad laminate to be electrically conductive.

4 . The printed circuit board of claim 3 , further comprising an electronic component being embedded in the cavity and being electrically connected with the pad.

5 . A method of manufacturing a printed circuit board, comprising:
providing a base board having a pad formed on one surface thereof; laminating an insulating adhesive layer on the one surface of the base board; and laminating a copper clad laminate having a cavity formed therein on the insulating adhesive layer in such a way that the pad is placed within the cavity.

6 . The method of claim 5 , further comprising, after the laminating of the copper clad laminate, forming a via hole integrally penetrating the base board and the copper clad laminate and allowing the base board and the copper clad laminate to be electrically conductive.

7 . The method of claim 6 , further comprising, after the forming of the via hole, removing a portion of the insulating adhesive layer corresponding to the pad in such a way that the pad is exposed.

8 . The method of claim 7 , further comprising, after the removing of the portion of the insulating adhesive layer corresponding to the pad, embedding an electronic component in the cavity for electrical connection with the pad.

Assignees

• Samsung Electro Mech

Inventors

• Mok Jee-Soo
• Baek Yong-Ho
• Ko Young-Gwan

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H05K1/113 Primary

  Via provided in pad; Pad over filled via · CPC title

• H05K3/022

  Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates · CPC title

• H05K3/30

  Assembling printed circuits with electric components, e.g. with resistors · CPC title

• H05K3/4038

  Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence) · CPC title