Circuit board and method of manufacturing thereof
US-12120812-B2 · Oct 15, 2024 · US
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Li yan-lu patents
Li yan-lu is listed as an inventor on 34 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Li yan-lu |
| Total patents | 34 |
| First publication | Jan 26, 2017 |
| Latest publication | Oct 15, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Board-to-board connection structure and method for manufacturing the same
US-12028976-B2 · Jul 2, 2024 · US
Circuit board and method for manufacturing the same
US-11985764-B2 · May 14, 2024 · US
Circuit board assembly and method of manufacturing the same, packaging structure having the same
US-2024147629-A1 · May 2, 2024 · US
Method for manufacturing a circuit board
US-11700698-B2 · Jul 11, 2023 · US
Method of manufacturing composite circuit board
US-11672083-B2 · Jun 6, 2023 · US
Circuit board and method of manufacturing thereof
US-2023171877-A1 · Jun 1, 2023 · US
Method for manufacturing flexible circuit board
US-11582859-B2 · Feb 14, 2023 · US
Board-to-board connection structure and method for manufacturing the same
US-2022338350-A1 · Oct 20, 2022 · US
Circuit board and method for manufacturing the same
US-2022248535-A1 · Aug 4, 2022 · US
Recent patents
Latest publications not already listed above.
Method for manufacturing a circuit board
US-2022192034-A1 · Jun 16, 2022 · US
Method for manufacturing a circuit board
US-11304312-B2 · Apr 12, 2022 · US
Method of manufacturing composite circuit board
US-2022030723-A1 · Jan 27, 2022 · US
Method for manufacturing flexible circuit board
US-2021400801-A1 · Dec 23, 2021 · US
Method of manufacturing composite circuit board and composite circuit board
US-11191168-B2 · Nov 30, 2021 · US
Method for manufacturing a circuit board
US-2021368633-A1 · Nov 25, 2021 · US
Flexible circuit board and method for manufacturing the same
US-11140769-B1 · Oct 5, 2021 · US
Method of manufacturing composite circuit board and composite circuit board
US-2021282273-A1 · Sep 9, 2021 · US
Waterproof circuit board and method for manufacturing the same
US-10681824-B1 · Jun 9, 2020 · US
Embedded circuit board and method of making same
US-10667402-B2 · May 26, 2020 · US
Method of manufacturing multilayer circuit board
US-10660218-B2 · May 19, 2020 · US
Multilayer circuit board and method of manufacturing the same
US-10653015-B2 · May 12, 2020 · US
Embedded circuit board and method of making same
US-2020037450-A1 · Jan 30, 2020 · US
Multilayer circuit board and method of manufacturing the same
US-2019289724-A1 · Sep 19, 2019 · US
Multilayer circuit board and method of manufacturing the same
US-2019289725-A1 · Sep 19, 2019 · US
Method for manufacturing an embedded flexible circuit board
US-2019281707-A1 · Sep 12, 2019 · US
Embedded flexible circuit board and method for manufacturing the same
US-2019223300-A1 · Jul 18, 2019 · US
Multilayer circuit board and method of manufacturing the same
US-10349533-B1 · Jul 9, 2019 · US
Flexible printed circuit board and method for manufacturing same
US-10285260-B2 · May 7, 2019 · US
Flexible printed circuit board and method for manufacturing the same
US-9980386-B1 · May 22, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Avary Holding Shenzhen Co Ltd | 30 |
| Hongqisheng Prec Electronics Qinhuangdao Co Ltd | 29 |
| Garuda Tech Co Ltd | 6 |
| Hongqisheng Prec Electronics (Qinhuangdao) Co Ltd | 4 |
| Fukui Prec Component (Shenzhen) Co Ltd | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K1/115 | 15 |
| H05K1/0298 | 12 |
| H05K1/0218 | 12 |
| H05K3/4611 | 12 |
| H05K1/189 | 11 |