Transfer head array and transferring method

Patent metadata

Field	Value
Publication number	US-9969078-B2
Application number	US-201514816060-A
Country	US
Kind code	B2
Filing date	Aug 3, 2015
Priority date	Aug 3, 2015
Publication date	May 15, 2018
Grant date	May 15, 2018

Abstract

A transfer head array includes a body and a plurality of transfer heads. The body has a first surface, a second surface opposite to the first surface, and a plurality of recesses. The first surface has at least one chucking region and at least one interference avoidance region, and the recesses are separated from each other and are disposed in the interference avoidance region. The transfer heads are disposed on the chucking region.

First claim

What is claimed is:

1. A transfer head array, comprising:
a body comprising:
a base portion; and
at least one wall portion on the base portion, wherein the wall portion defines a plurality of recesses in the body, the wall portion completely encloses a perimeter of each of the recesses in the body, the wall portion has a top surface, and the top surface of the wall portion has a plurality of grip regions; and
a plurality of transfer heads respectively on the grip regions.

2. The transfer head array of claim 1 , wherein the top surface of the wall portion is substantially flat.

3. The transfer head array of claim 1 , wherein the grip regions are higher than other regions of the top surface of the wall portion.

4. The transfer head array of claim 1 , wherein the grip regions are wider than other regions of the top surface of the wall portion.

5. The transfer head array of claim 1 , wherein the grip regions are narrower than other regions of the top surface of the wall portion.

6. The transfer head array of claim 1 , wherein at least two of the recesses have different depths.

7. The transfer head array of claim 1 , wherein at least two of the recesses have different sizes.

8. The transfer head array of claim 1 , wherein the top surface of the wall portion is strip-shaped, grid-shaped, zigzag-shaped, or combinations thereof.

9. The transfer head array of claim 1 , wherein the grip regions are aligned with each other.

10. The transfer head array of claim 1 , wherein the grip regions are arranged in a staggered pattern.

11. The transfer head array of claim 1 , wherein at least one of the transfer heads comprises:
at least one electrode disposed on at least one of the grip regions; and
a dielectric layer overlaying at least the electrode.

12. The transfer head array of claim 11 , wherein the dielectric layer is made of a mixture of nano-particles of a dielectric or ferroelectric material and at least one polymer material.

13. The transfer head array of claim 11 , further comprising:
at least one electrode lead electrically connected to the electrode and on the top surface of the wall portion.

14. The transfer head array of claim 1 , further comprising:
an isolation layer overlaying at least the wall portion, wherein the transfer heads are disposed at least partially on the isolation layer; and
a shielding layer disposed in the isolation layer, wherein a vertical projection of the shielding layer on the top surface of the wall portion at least partially overlaps with an area complementary to the grip regions.

15. The transfer head array of claim 1 , wherein the transfer heads has a patterned adhesive layer.

16. The transfer head array of claim 1 , wherein the base portion and the wall portion are made of the same material.

17. The transfer head array of claim 1 , wherein the base portion and the wall portion are made of different materials.

18. The transfer head array of claim 1 , wherein at least two of the recesses are isolated from each other by the wall portion.

19. The transfer head array of claim 1 , wherein each of the recesses is open only at a side facing away from the base portion.

20. The transfer head array of claim 1 , wherein the perimeter of each of the recesses is closed and defined by the wall portion.

21. A micro device transferring method, comprising:
gripping at least one first micro device by at least one transfer head of a transfer head array, wherein the transfer head array has at least one wall portion defining at least one recess; wherein an entire perimeter of the at least one recess is enclosed by said at least one wall; and
putting the first micro device gripped by the transfer head of the transfer head array on a receiving substrate, wherein when putting the first micro device gripped by the transfer head of the transfer head array on the receiving substrate, at least one second micro device is located on the receiving substrate, a top surface of the second micro device is higher than a gripping surface of the transfer head in relation to the receiving substrate, the gripping surface is where the first micro device is gripped, and the second micro device is at least partially received in the recess, such that the second micro device is free from contact with the transfer head array.

22. The micro device transferring method of claim 21 , wherein the first micro device has a height A, the second micro device has a height B, the recess has a depth C, and A+C>B.

Assignees

• Mikro Mesa Tech Co Ltd

Inventors

• Chen Li-Yi
• Chang Pei-Yu
• Chan Chih-Hui
• Chang Chun-Yi
• Lin Shih-Chyn
• Lee Hsin-Wei

Classifications

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/0711

  Apparatus therefor · CPC title

• H10W72/07178

  Means for aligning · CPC title

• B25J15/0052

  multiple gripper units or multiple end effectors · CPC title