Multilayer wiring substrate
US-2022124908-A1 · Apr 21, 2022 · US
Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/245 |
| Official title | {Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques} |
| Display label | Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques |
| Total patents | 74 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 16 |
| 2016 | 6 |
| 2017 | 13 |
| 2018 | 5 |
| 2019 | 8 |
| 2020 | 5 |
| 2021 | 5 |
| 2022 | 7 |
| 2023 | 3 |
| 2024 | 4 |
| 2025 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Stretchable mounting board
US-2022078904-A1 · Mar 10, 2022 · US
Stretchable mounting board
US-11212915-B2 · Dec 28, 2021 · US
Composite conductive substrate and manufacturing method thereof
US-11089678-B2 · Aug 10, 2021 · US
Copper-ceramic composite
US-11021406-B2 · Jun 1, 2021 · US
Stretchable mounting board
US-2021045236-A1 · Feb 11, 2021 · US
Nanowire-based transparent conductors and applications thereof
US-2021028321-A1 · Jan 28, 2021 · US
Applying a solderable surface to conductive ink
US-2020404795-A1 · Dec 24, 2020 · US
Multilayer wiring substrate
US-2020296839-A1 · Sep 17, 2020 · US
Nanowire-based transparent conductors and applications thereof
US-10749048-B2 · Aug 18, 2020 · US
Composite conductive substrate and manufacturing method thereof
US-2020253046-A1 · Aug 6, 2020 · US
Liquid metal fusion with conductive inks and pastes
US-2020221580-A1 · Jul 9, 2020 · US
Conductive patterns and methods of using them
US-10462908-B2 · Oct 29, 2019 · US
Method for stencil printing during manufacture of printed circuit board
US-10426039-B2 · Sep 24, 2019 · US
Composite transparent conductors and methods of forming the same
US-2019191569-A1 · Jun 20, 2019 · US
Method for reinforcing conductor tracks of a circuit board
US-10276482-B2 · Apr 30, 2019 · US
Composite transparent conductors and methods of forming the same
US-10244637-B2 · Mar 26, 2019 · US
Copper-ceramic composite
US-2019084893-A1 · Mar 21, 2019 · US
Printed wiring board and method of producing the same
US-10212810-B2 · Feb 19, 2019 · US
Circuit board
US-2019029124-A1 · Jan 24, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/245?
- CPC H05K3/245 is the Cooperative Patent Classification code for “Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques.”
- How many patents are filed under CPC H05K3/245 (Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques)?
- Our database includes 74 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/245 growing?
- Publication counts under this code: 4 in 2024 vs 2 in 2025 (latest complete years).