Silicone-modified epoxy resin, composition containing the epoxy resin, and cured product of same

Patent metadata

Field	Value
Publication number	US-9963542-B2
Application number	US-201515300645-A
Country	US
Kind code	B2
Filing date	Mar 25, 2015
Priority date	Mar 31, 2014
Publication date	May 8, 2018
Grant date	May 8, 2018

Abstract

A silicone-modified epoxy resin which yields a cured product having low gas permeability and excellent strength; a composition of the silicone-modified epoxy resin; and an epoxy resin cured product obtainable by curing the composition, are provided.
An epoxy resin represented by the following Formula (1):

wherein R 1 represents a hydrocarbon group having 1 to 6 carbon atoms; X represents an organic group having a norbornane epoxy structure, or a hydrocarbon group having 1 to 6 carbon atoms; n represents an integer from 1 to 3; plural R 1 s and plural Xs present in the formula may be respectively identical or different; and two or more of plural Xs represent an organic group having a norbornane epoxy structure.

First claim

What is claimed is:

1. A composition comprising a silicone-modified epoxy resin (A) represented by the following Formula (1):

wherein R 1 represents a hydrocarbon group having 1 to 6 carbon atoms; X represents an organic group represented by the following Formula (2) or a hydrocarbon group having 1 to 6 carbon atoms; n represents an integer from 1 to 3; plural R 1 s and plural Xs present in the formula may be respectively identical or different; and two or more of plural Xs represent an organic group represented by the following Formula (2):

wherein R 2 represents an alkylene group having 2 to 3 carbon atoms; and m represents an integer from 0 to 2, and 3′,4′-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate.

2. The composition according to claim 1 , wherein the silicone-modified epoxy resin is an addition reaction product between a compound represented by the following Formula (3) and a compound represented by the following Formula (4):

wherein R 1 and n respectively have the same meanings as defined above; each Y represents a hydrogen atom or a hydrocarbon group having 1 to 6 carbon atoms; plural R 1 s and plural Ys present in Formula may be respectively identical or different; and two or more of plural Ys represent hydrogen atoms:

wherein m has the same meaning as defined above; and R 3 represents a single bond or a methylene group.

3. The composition according to claim 1 , wherein n is 2.

4. The composition according to claim 1 , wherein the silicone-modified epoxy resin is obtained by oxidizing a polyvalent olefin-based compound represented by the following Formula (5):

wherein R 1 and n respectively have the same meanings as defined above; Z represents an organic group represented by the following Formula (6) or a hydrocarbon group having 1 to 6 carbon atoms; plural R 1 s and plural Zs present in Formula may be respectively identical or different; and two or more of plural Zs represent an organic group represented by the following Formula (6):

wherein R 2 and m respectively have the same meanings as defined above.

5. An epoxy resin composition comprising the (A) silicone-modified epoxy resin according to claim 1 ; 3′,4′-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate; and (B) an epoxy resin curing agent.

6. An epoxy resin composition according to claim 5 , wherein the epoxy resin curing agent according to claim 5 is at least one selected from amine-based curing agents, phenolic curing agents, acid anhydride-based curing agents, and polyvalent carboxylic acid resins.

7. A cured product obtained by curing the epoxy resin composition according to claim 5 .

8. An epoxy resin composition comprising the (A) silicone-modified epoxy resin according to claim 1 ; 3′,4′-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate; and (C) an epoxy resin curing accelerator.

Assignees

• Shinetsu Chemical Co
• Nippon Kayaku Kk

Inventors

• Shiobara Toshio
• Sawada Junichi
• Wakao Miyuki
• Kashiwagi Tsutomu
• Miyagawa Naofusa
• Kawada Yoshihiro
• Sasaki Chie
• Taniguchi Naosuke

Classifications

• C08G59/3281 Primary

  containing silicon · CPC title

• C08G59/4284

  together with other curing agents · CPC title

• C08G59/38

  together with di-epoxy compounds · CPC title

• C08G59/4269

  Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings (C08G59/4253 takes precedence) · CPC title

• C08G59/4238

  heterocyclic · CPC title