Curable composition and cured product of the same, and wafer-level lens
US-2024059831-A1 · Feb 22, 2024 · US
containing silicon
containing silicon · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G59/3281 |
| Official title | {containing silicon} |
| Display label | containing silicon |
| Total patents | 164 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 9 |
| 2016 | 10 |
| 2017 | 15 |
| 2018 | 18 |
| 2019 | 18 |
| 2020 | 18 |
| 2021 | 19 |
| 2022 | 12 |
| 2023 | 14 |
| 2024 | 18 |
| 2025 | 8 |
| 2026 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Epoxy resin composition
US-2019359822-A1 · Nov 28, 2019 · US
Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor device
US-10428239-B2 · Oct 1, 2019 · US
Silicone-modified epoxy resin composition and semiconductor device
US-2019144704-A1 · May 16, 2019 · US
Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device
US-2019070837-A1 · Mar 7, 2019 · US
Curable resin composition and cured product thereof, sealing material for optical semiconductor, die bonding material, and optical semiconductor light-emitting element
US-10208206-B2 · Feb 19, 2019 · US
Curable composition, cured film, display panel or oled light, and method for producing cured product
US-2019031818-A1 · Jan 31, 2019 · US
Composition for heat-dissipating member, heat-dissipating member, electronic instrument, and method for producing heat-dissipating member
US-2019023847-A1 · Jan 24, 2019 · US
Window film composition, flexible window film formed therefrom and flexible display device containing same
US-2018371189-A1 · Dec 27, 2018 · US
Moulded body
US-2018362803-A1 · Dec 20, 2018 · US
Semiconductor apparatus, stacked semiconductor apparatus and encapsulated stacked-semiconductor apparatus each having photo-curable resin layer
US-10141272-B2 · Nov 27, 2018 · US
Silicone-modified epoxy resin composition and semiconductor device
US-2018334567-A1 · Nov 22, 2018 · US
Resin compositions for underfill film for three dimensional through silica via (tsv) packages and compositions useful for the preparation thereof
US-2018319973-A1 · Nov 8, 2018 · US
Polyorganosilsesquioxane, hard coat film, adhesive sheet, and laminate
US-2018282485-A1 · Oct 4, 2018 · US
Curable composition, cured product thereof, optical member and optical device
US-2018284396-A1 · Oct 4, 2018 · US
Resin composition, resin film, semiconductor device and method of manufacture thereof
US-10026650-B2 · Jul 17, 2018 · US
Curable composition, cured product thereof, optical member and optical device
US-10018810-B2 · Jul 10, 2018 · US
Heat-curable epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using same
US-10008646-B2 · Jun 26, 2018 · US
Antifouling system comprising silicone hydrogel
US-9988497-B2 · Jun 5, 2018 · US
Hard coating composition and flexible display device including the hard coating composition
US-2018142127-A1 · May 24, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G59/3281?
- CPC C08G59/3281 is the Cooperative Patent Classification code for “containing silicon.”
- How many patents are filed under CPC C08G59/3281 (containing silicon)?
- Our database includes 164 publications tagged with this CPC code.
- Is patent activity under CPC C08G59/3281 growing?
- Publication counts under this code: 18 in 2024 vs 8 in 2025 (latest complete years).