the layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection (using interposed adhesives or bonding materials applied in spaced arrangements B32B7/14)

the layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection (using interposed adhesives or bonding materials applied in spaced arrangements B32B7/14) · Cooperative Patent Classification (CPC)

Separating, mixing, shaping, printing, and transporting materials.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeB32B7/05
Official titlethe layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection (using interposed adhesives or bonding materials applied in spaced arrangements B32B7/14)
Display labelthe layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection (using interposed adhesives or bonding materials applied in spaced arrangements B32B7/14)
Total patents1,698

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is declining.

Patents filed per year
YearPatents
201591
2016125
2017161
2018155
2019165
2020182
2021160
2022192
2023169
2024152
2025123
202623

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC B32B7/05?
CPC B32B7/05 is the Cooperative Patent Classification code for “the layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection (using interposed adhesives or bonding materials applied in spaced arrangements B32B7/14).”
How many patents are filed under CPC B32B7/05 (the layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection (using interposed adhesives or bonding materials applied in spaced arrangements B32B7/14))?
Our database includes 1,698 publications tagged with this CPC code.
Is patent activity under CPC B32B7/05 growing?
Publication counts under this code: 152 in 2024 vs 123 in 2025 (latest complete years).