Light-Emitting Device, Module, Electronic Device, and Method for Manufacturing Light-Emitting Device

Patent metadata

Field	Value
Publication number	US-2016111485-A1
Application number	US-201514882918-A
Country	US
Kind code	A1
Filing date	Oct 14, 2015
Priority date	Oct 17, 2014
Publication date	Apr 21, 2016
Grant date	—

Abstract

A light-emitting element, a bonding layer, and a frame-like partition are formed over a substrate. The partition is provided to surround the bonding layer and the light-emitting element, with a gap left between the partition and the bonding layer. A pair of substrates overlap with each other under a reduced-pressure atmosphere and then exposed to an air atmosphere or a pressurized atmosphere, whereby the reduced-pressure state of a space surrounded by the pair of substrates and the partition is maintained and atmospheric pressure is applied to the pair of substrates. Alternatively, a light-emitting element and a bonding layer are formed over a substrate. A pair of substrates overlap with each other, and then, pressure is applied to the bonding layer with the use of a member having a projection before or at the same time as curing of the bonding layer.

First claim

1 . A light-emitting device comprising:
a light-emitting portion; and a non-light-emitting portion, wherein the light-emitting portion is surrounded by the non-light-emitting portion, wherein the non-light-emitting portion comprises a first portion and a second portion, wherein the first portion is closer to the light-emitting portion than the second portion is, wherein the first portion has a thickness smaller than a thickness of the second portion, and wherein the thickness of the first portion is smaller than a thickness of the light-emitting portion.

2 . The light-emitting device according to claim 1 ,
wherein the light-emitting portion is surrounded by the first portion, and wherein the first portion is surrounded by the second portion.

3 . The light-emitting device according to claim 1 ,
wherein the thickness of the first portion decreases from the light-emitting portion side to an end portion side of the light-emitting device, and wherein the thickness of the second portion increases from the light-emitting portion side to the end portion side of the light-emitting device.

4 . The light-emitting device according to claim 1 ,
wherein the light-emitting portion comprises a bonding layer, wherein the non-light-emitting portion comprises the bonding layer, wherein the bonding layer comprises a third portion and a fourth portion, wherein the third portion is closer to the light-emitting portion than the fourth portion is, and wherein a thickness of the third portion is smaller than a thickness of the fourth portion.

5 . The light-emitting device according to claim 4 ,
wherein the thickness of the third portion decreases from the light-emitting portion side to an end portion side of the light-emitting device, and wherein the thickness of the fourth portion increases from the light-emitting portion side to the end portion side of the light-emitting device.

6 . The light-emitting device according to claim 1 ,
wherein the light-emitting device has flexibility.

7 . The light-emitting device according to claim 1 ,
wherein the light-emitting portion comprises a light-emitting element and a transistor, wherein the transistor is electrically connected to the light-emitting element, and wherein the light-emitting element is an organic EL element.

8 . The light-emitting device according to claim 1 ,
wherein the non-light-emitting portion comprises at least one of a signal line driver circuit and a scan line driver circuit.

9 . A light-emitting device comprising:
a light-emitting portion comprising:
a first flexible substrate;
a first insulating layer;
a first bonding layer between the first flexible substrate and the first insulating layer;
a second flexible substrate;
a second bonding layer between the second flexible substrate and the first insulating layer; and
a first functional layer between the second bonding layer and the first insulating layer; and
a non-light-emitting portion comprising:
the first flexible substrate;
the first bonding layer;
the first insulating layer;
the second bonding layer; and
the second flexible substrate,
wherein the first bonding layer and the second bonding layer partly overlap with each other with the first insulating layer positioned therebetween, wherein the first functional layer comprises a light-emitting element, and wherein a gap between the first flexible substrate and the second flexible substrate is smaller in at least part of the non-light-emitting portion than in the light-emitting portion.

10 . The light-emitting device according to claim 9 ,
wherein the light-emitting portion is surrounded by the non-light-emitting portion, wherein the non-light-emitting portion comprises a first portion and a second portion, wherein the first portion is closer to the light-emitting portion than the second portion is, and wherein the gap between the first flexible substrate and the second flexible substrate is smaller in the first portion than in the second portion.

11 . The light-emitting device according to claim 10 ,
wherein the gap between the first flexible substrate and the second flexible substrate is smaller in the second portion than in the light-emitting portion.

12 . The light-emitting device according to claim 10 ,
wherein the light-emitting portion is surrounded by the first portion, and wherein the first portion is surrounded by the second portion.

13 . The light-emitting device according to claim 10 ,
wherein the light-emitting portion comprises:
a third bonding layer between the second bonding layer and the first insulating layer;
a second insulating layer between the second bonding layer and the third bonding layer; and
a second functional layer,
wherein the non-light-emitting portion comprises:
the third bonding layer; and
the second insulating layer,
wherein the first functional layer and the second functional layer partly overlap with each other with the third bonding layer positioned therebetween, and wherein the second functional layer comprises a coloring layer.

14 . A manufacturing method of a light-emitting device, comprising first to fifth steps,
wherein the first step comprises a step of forming a light-emitting element over a first substrate, wherein the second step comprises a step of forming a bonding layer and a partition over the first substrate or a second substrate, wherein the third step comprises a step of making the first substrate and the second substrate overlap with each other under a first atmosphere to position the light-emitting element in a space surrounded by the partition, the first substrate, and the second substrate, wherein the fourth step comprises a step of exposing the first substrate and the second substrate to a second atmosphere to fill part of the space with the bonding layer, to make the bonding layer spread toward an end portion of the light-emitting device, and to make the end portion of the light-emitting device comprise a smaller thickness than a middle portion of the light-emitting device, wherein the fifth step comprises a step of curing the bonding layer and the partition under the second atmosphere, wherein the first atmosphere has a lower pressure than the second atmosphere, and wherein in the second step, the partition is formed to surround the bonding layer with a gap left between the partition and the bonding layer.

15 . The manufacturing method of the light-emitting device, according to claim 14 ,
wherein the first atmosphere is a reduced-pressure atmosphere, and wherein the second atmosphere is an air atmosphere or a pressurized atmosphere.

16 . A manufacturing method of a light-emitting device, comprising first to fifth steps,
wherein the first step comprises a step of forming a light-emitting element over a first substrate, wherein the second step comprises a step of forming a bonding layer over the first substrate or a second substrate, wherein the third step comprises a step of making the first substrate and the second substrate overlap with each other to surround the light-emitting element with the bonding layer, the first substrate, and the second substrate, wherein the fourth step comprises a step of applying pressure to the bonding layer with a member comprising a projection to make an end portion of the light-emitting device comprise a smaller thickness than a middle portion of the light-emitting device, and wherein the fifth step comprises a step of curing the bonding layer.

17 . The manufacturing method of the light-emitting device,

Assignees

• Semiconductor Energy Lab

Inventors

• Chida Akihiro

Classifications

• Y02E10/549

  Organic PV cells · CPC title

• H10K2102/351

  Thickness · CPC title

• H10K59/8722

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

• H10K71/40

  Thermal treatment, e.g. annealing in the presence of a solvent vapour · CPC title

• H10K59/871

  Self-supporting sealing arrangements · CPC title