Shield can, electronic device, and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9924616-B2
Application number	US-201514640520-A
Country	US
Kind code	B2
Filing date	Mar 6, 2015
Priority date	Mar 17, 2014
Publication date	Mar 20, 2018
Grant date	Mar 20, 2018

Abstract

A shield can for electromagnetic shielding is provided. The shield can includes a shield cover having a bump protruding laterally therefrom, and a shield frame having a connecting part for selectively fixing the bump at a first height or a second height such that the shield frame is fastened to the shield cover. An electronic device includes a substrate, an internal device mounted on the substrate, and the shield can. The shield cover is located over the internal device, and the shield frame is formed vertically on the substrate to surround the internal device.

First claim

What is claimed is:

1. A shield can for electromagnetic shielding, the shield can comprising:
a shield cover having a bump protruding at a height of the shield cover laterally therefrom; and
a shield frame having a connecting part for selectively fixing the same bump at a first height or a second height of the shield frame such that the shield frame is fastened to the shield cover,
wherein the connecting part includes:
a first hole for fixing the same bump at the first height of the shield frame and,
a second hole for fixing the same bump at the second height of the shield frame, the first hole and the second hole are aligned vertically.

2. The shield can of claim 1 ,
wherein the first hole and the second hole include an opening for receiving the same bump.

3. The shield can of claim 1 , wherein the shield cover has another bump.

4. The shield can of claim 3 , wherein the connecting part further includes:
a third hole, and
a fourth hole for selectively fixing the other bump at a third height of the shield frame or a fourth height of the shield frame.

5. An electronic device comprising:
a substrate;
an internal device mounted on the substrate; and
a shield can that comprises:
a shield cover located over the internal device and having a bump protruding at a height of the shield cover laterally therefrom, and
a shield frame formed vertically on the substrate to surround the internal device and having a connecting part for selectively fixing the bump at a first height or a second height of the shield frame to be fastened to the shield cover, wherein the connecting part includes:
a first hole for fixing the same bump at the first height of the shield frame, and
a second hole for fixing the same bump at the second height of the shield frame, the first hole and the second hole are aligned vertically.

6. The electronic device of claim 5 , further comprising a thermal interface material (TIM) attached to a lower surface of the shield cover, the lower surface facing a top surface of the internal device.

7. The electronic device of claim 6 ,
wherein the first height from the substrate is greater than the second height from the substrate, and
wherein the TIM is in contact with the top surface of the internal device when the same bump of the shield cover is fixed at the second hole.

8. The electronic device of claim 5 ,
wherein the first hole and the second hole have an opening for receiving the same bump.

9. The electronic device of claim 5 , wherein the shield cover has another bump.

10. The electronic device of claim 9 , wherein the connecting part further includes:
a third hole, and
a fourth hole for selectively fixing the other bump at a third height of the shield frame or a fourth height of the shield frame.

11. A shield can for electromagnetic shielding, the shield can comprising:
a shield cover having a first protrusion at a height of the shield cover extending laterally therefrom; and
a shield frame having a connecting part for coupling with the first protrusion at a first height or a second height of the shield frame such that the shield frame is coupled with the shield cover,
wherein the connecting part includes:
a first hole for fixing the first protrusion at the first height of the shield frame, and
a second hole for fixing the first protrusion at the second height of the shield frame, the first hole and the second hole are aligned vertically.

12. The shield can of claim 11 ,
wherein the first hole and the second hole have an opening for receiving the first protrusion.

13. The shield can of claim 11 , wherein the shield cover has a second protrusion.

14. The shield can of claim 13 , wherein the connecting part further includes:
a third hole, and
a fourth hole for selectively fixing the second protrusion at a third height of the shield frame or a fourth height of the shield frame.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Song Kyunghoon
• Bang Jungje
• Lee Kwangsub
• Lee Saebom
• Jang Seyoung
• Chi Younoh

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W42/20

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title

• H10W40/70

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title

• H05K9/0032

  having multiple parts, e.g. frames mating with lids · CPC title