Electronic apparatus

Patent metadata

Field	Value
Publication number	US-2016270261-A1
Application number	US-201514793161-A
Country	US
Kind code	A1
Filing date	Jul 7, 2015
Priority date	Mar 10, 2015
Publication date	Sep 15, 2016
Grant date	—

Abstract

According to one embodiment, an electronic apparatus includes a first substrate, a second substrate, an electronic component, a housing, and a protruding portion. The first substrate has a first face and a second face and is provided with an opening. The second substrate has a third face configured to face the second face and a fourth face and is configured to be electrically connected to the first substrate. The electronic component is configured to be mounted on the third face and is configured to be disposed at a position overlapping the opening in a direction in which the third face faces. The housing is configured to accommodate the first and second substrates. The protruding portion is provided in the housing and is configured to pass through the opening and be thermally connected to the electronic component.

First claim

What is claimed is:

1 . An electronic apparatus comprising:
a first substrate comprising a first face and a second face on an opposite side of the first face and provided with an opening; a second substrate comprising a third face configured to face the second face and a fourth face on an opposite side of the third face and configured to be electrically connected to the first substrate; at least one first electronic component configured to be mounted on at least one of the first and second substrates and store information; a second electronic component configured to be mounted on the third face of the second substrate, control the first electronic components, generate a larger amount of heat than the first electronic components and be disposed at a position overlapping the opening in a direction in which the third face faces; a housing configured to accommodate the first and second substrates and comprising a first cover configured to cover the first face of the first substrate; a first protruding portion provided on the first cover and configured to protrude toward the second electronic component and pass through the opening; and a first heat transfer member configured to be interposed between the first protruding portion and the second electronic component and connect the first protruding portion and the second electronic component thermally.

2 . The electronic apparatus of claim 1 , wherein
the second electronic component is longer than the first electronic components in the direction in which the third face of the second substrate faces.

3 . The electronic apparatus of claim 2 , wherein
when seen in a plan view from the direction in which the third face faces, the second electronic component is configured to be surrounded by edges of the first substrate, which form the opening.

4 . The electronic apparatus of claim 3 , further comprising
a second heat transfer member, wherein the housing further includes a second cover configured to cover the fourth face of the second substrate, at least one of the first electronic components is configured to be mounted on the fourth face of the second substrate, and the second heat transfer member is configured to connect the second cover and the first electronic components mounted on the fourth face thermally.

5 . The electronic apparatus of claim 4 , further comprising
a third heat transfer member, wherein at least one of the first electronic components is configured to be mounted on the first face of the first substrate, and the third heat transfer member is configured to connect the housing and the first electronic components mounted on the first face thermally.

6 . The electronic apparatus of claim 5 , further comprising:
a first connector mounted on the second face of the first substrate and configured to protrude toward the third face of the second substrate; a second connector mounted on the third face of the second substrate and configured to protrude toward the second face of the first substrate, be connected to the first connector, and connect the first and second substrates electrically; and a second protruding portion provided in the housing and configured to protrude toward the first face of the first substrate and be thermally connected to a position of the first face overlapping the first connector in a direction in which the first face faces.

7 . The electronic apparatus of claim 6 , wherein
the first substrate and the first connector are configured to be held between the second protruding portion and the second connector.

8 . The electronic apparatus of claim 7 , wherein
the first connector is configured to be disposed substantially in a central portion of the first substrate in a direction in which the first substrate extends.

9 . The electronic apparatus of claim 8 , wherein
at least one of the first electronic components is configured to be mounted at a position of the fourth face of the second substrate overlapping the second connector in a direction in which the fourth face faces.

10 . The electronic apparatus of claim 9 , further comprising
a fin configured to be provided on the first cover.

11 . The electronic apparatus of claim 10 , wherein
the housing comprises a frame, the first substrate is configured to be attached to the frame, the second substrate is configured to be attached to the frame at a position separated from the first substrate in the direction in which the third face faces, and the first cover is configured to be attached to the frame.

12 . The electronic apparatus of claim 1 , further comprising:
a first connector mounted on the second face of the first substrate and configured to protrude toward the third face of the second substrate; a second connector mounted on the third face of the second substrate and configured to protrude toward the second face of the first substrate, be connected to the first connector, and connect the first and second substrates electrically; and a second protruding portion provided in the housing and configured to protrude toward the first face of the first substrate and be thermally connected to a position of the first face overlapping the first connector in a direction in which the first face faces.

13 . The electronic apparatus of claim 12 , wherein
the first substrate and the first connector are configured to be held between the second protruding portion and the second connector.

14 . The electronic apparatus of claim 13 , wherein
the first connector is configured to be disposed substantially in a central portion of the first substrate in a direction in which the first substrate extends.

15 . The electronic apparatus of claim 14 , wherein
at least one of the first electronic components is configured to be mounted at a position of the fourth face of the second substrate overlapping the second connector in a direction in which the fourth face faces.

16 . The electronic apparatus of claim 3 , further comprising:
a first connector mounted on the second face of the first substrate and configured to protrude toward the third face of the second substrate; a second connector mounted on the third face of the second substrate and configured to protrude toward the second face of the first substrate, be connected to the first connector, and connect the first and second substrates electrically; and a second protruding portion provided in the housing and configured to protrude toward the first face of the first substrate and be thermally connected to a position of the first face overlapping the first connector in a direction in which the first face faces.

17 . The electronic apparatus of claim 16 , wherein
the first substrate and the first connector are configured to be held between the second protruding portion and the second connector.

18 . The electronic apparatus of claim 17 , wherein
the first connector is configured to be disposed substantially in a central portion of the first substrate in a direction in which the first substrate extends.

19 . The electronic apparatus of claim 18 , wherein
at least one of the first electronic components is configured to be mounted at a position of the fourth face of the second substrate overlapping the second connector in a direction in which the fourth face faces.

20 . An electronic apparatus comprising:
a first substrate comprising a first face and a second face on an opposite side of the first face and provided with an opening; a second substrate comprising a third

Assignees

• Toshiba Kk

Inventors

• Matsuda Yoshiharu
• Yoshida Kazuhiro
• Sawanaka Kenichi

Classifications

• G11B33/1406

  Reducing the influence of the temperature · CPC title

• G11B33/128

  of the plurality of recording/reproducing devices, e.g. disk drives, onto a chassis · CPC title

• H05K7/20409

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title

• H05K7/20445 Primary

  the coupling element being an additional piece, e.g. thermal standoff · CPC title

• H05K7/1427

  Housings · CPC title