Chip packaging method, chip packaging module, and embedded substrate chip packaging structure
US-2024413138-A1 · Dec 12, 2024 · US
Set-top box having dissipating thermal loads
US9220185B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9220185-B2 |
| Application number | US-201113698868-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 12, 2011 |
| Priority date | May 19, 2010 |
| Publication date | Dec 22, 2015 |
| Grant date | Dec 22, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A set-top box is provided that comprises a housing having a first vertical outer wall with a first vent and a second vertical outer wall with a second vent; a circuit board having a first heat source element and a second heat source element; a contoured heatsink in thermal engagement with the first heat source element, wherein the contoured heatsink overlies at least one-third of the circuit board and extends along the first vertical side wall; and a second heatsink contacting the second heat source element, wherein the second heatsink is located in only one half of the device and is aligned with the second vent. The multiple heatsinks and associated vents work in concert to improve heat dissipation.
First claim
Opening claim text (preview).
The invention claimed is: 1. A set-top box comprising: a housing having a first vertical outer wall with a first vent and a second vertical outer wall with a second vent; a circuit board having a first heat source element and a second heat source element; a contoured heatsink in thermal engagement with the first heat source element, wherein the contoured heatsink overlies at least one-third of the circuit board and extends along a first vertical side wall; a second heatsink…
Assignees
Inventors
Classifications
Electricity · mapped topic
- H10W40/10Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H05K7/20409Primary
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9220185B2 cover?
- A set-top box is provided that comprises a housing having a first vertical outer wall with a first vent and a second vertical outer wall with a second vent; a circuit board having a first heat source element and a second heat source element; a contoured heatsink in thermal engagement with the first heat source element, wherein the contoured heatsink overlies at least one-third of the circuit bo…
- Who is the assignee on this patent?
- Ritter Darin Bradley, Hunt Mickey Jay, Gysin Mark William, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H10W40/10. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 22 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).