Printed board and electronic apparatus

Patent metadata

Field	Value
Publication number	US-9924590-B2
Application number	US-201615159393-A
Country	US
Kind code	B2
Filing date	May 19, 2016
Priority date	May 19, 2015
Publication date	Mar 20, 2018
Grant date	Mar 20, 2018

Abstract

A printed board includes: a base member; a recess portion provided in the base member; a heat dissipation member fitted into the recess portion; and a wiring pattern provided on an upper side of the base member and the heat dissipation member via an insulator. A contact portion in which an inner circumferential surface of the recess portion and an outer circumferential surface of the heat dissipation member contact each other and a separation portion in which those do contact each other are formed. A gap between the recess portion and the heat dissipation member is filled with thermosetting resin of the base member melted by heating. At least a partial portion in a width direction of the wiring pattern passes through a position vertically overlapping the separation portion while an entire portion thereof does not pass through a position vertically overlapping the contact portion.

First claim

The invention claimed is:

1. A printed board comprising:
a base member comprising a reinforcement member and a thermosetting resin, and formed in a plate shape;
a recess portion provided on a lower surface of the base member;
a heat dissipation member fitted into the recess portion; and
a wiring pattern provided on an upper side of the base member and the heat dissipation member via an insulator,
wherein a contact portion in which an inner circumferential surface of the recess portion and an outer circumferential surface of the heat dissipation member are in contact with each other and a separation portion in which the inner circumferential surface of the recess portion and the outer circumferential surface of the heat dissipation member are not in contact with each other are formed in a state in which the heat dissipation member is fitted into the recess portion,
wherein the separation portion includes a gap between the recess portion and the heat dissipation member that is filled with the thermosetting resin of the base member, and
wherein the wiring pattern is provided such that at least a partial portion in a first direction of the wiring pattern passes through a position vertically overlapping the separation portion while an entire portion in the first direction of the wiring pattern does not pass through a position vertically overlapping the contact portion.

2. The printed board according to claim 1 ,
wherein the contact portion is a plurality of contact portions and the separation portion is a plurality of separation portions, the plurality of contact portions and separation portions are respectively and alternately provided in a predetermined interval in a circumferential direction of the recess portion and the heat dissipation member.

3. The printed board according to claim 1 ,
wherein the contact portion is formed by a protruding portion formed on the inner circumferential surface of the recess portion, and
wherein the separation portion is formed by a portion other than the protruding portion on the inner circumferential surface of the recess portion.

4. The printed board according to claim 1 ,
wherein the base member comprises:
a first insulation layer comprising the insulator on which the wiring pattern is provided on the upper surface of the base member, and
a second insulation layer provided on a lower surface of the first insulation layer,
wherein the inner circumferential surface of the recess portion is formed by an inner circumferential surface of a through-hole formed in the second insulation layer,
wherein a bottom surface of the recess portion is formed by the lower surface of the first insulation layer, and
wherein the wiring pattern reaches a position vertically overlapping the heat dissipation member from a position not vertically overlapping the heat dissipation member through the position where at least a partial portion in the first direction of the wiring pattern vertically overlaps the separation portion.

5. The printed board according to claim 1 ,
wherein the wiring pattern is provided such that the entire portion in the first direction of the wiring pattern passes through the position vertically overlapping the separation portion.

6. An electronic apparatus comprising:
the printed board according to claim 1 ; and
an electronic component mounted on the printed board on the position vertically overlapping the heat dissipation member.

7. The electronic apparatus according to claim 6 ,
wherein the heat dissipation member is exposed from a lower surface of the printed board, and
wherein the electronic apparatus further comprises an external heat dissipation body provided on a lower side of the printed board so as to be in contact with an exposed surface of the heat dissipation member.

Assignees

• Kobayashi Tomoyoshi
• Kasashima Masato
• Omron Automotive Electronics

Inventors

• Kobayashi Tomoyoshi
• Kasashima Masato

Classifications

• H05K3/4697

  having cavities, e.g. for mounting components (H05K3/4691 takes precedence) · CPC title

• H05K2201/10416

  Metallic blocks or heatsinks completely inserted in a PCB · CPC title

• H05K2201/0187

  with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties · CPC title

• H05K2201/09145

  Edge details · CPC title

• H05K2201/09227

  Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting · CPC title