Wiring board and mounting structure using same

Patent metadata

Field	Value
Publication number	US-2016150642-A1
Application number	US-201414779232-A
Country	US
Kind code	A1
Filing date	Mar 26, 2014
Priority date	Mar 27, 2013
Publication date	May 26, 2016
Grant date	—

Abstract

A wiring board includes: an inorganic insulating layer having a via hole formed so as to penetrate the inorganic insulating layer in a thickness direction thereof; a conductive layer disposed on the inorganic insulating layer; and a via conductor which adheres to an inner wall of the via hole and is connected with the conductive layer. The inorganic insulating layer includes a first section including a plurality of inorganic insulating particles partly connected to each other, and a resin portion located in gaps between the inorganic insulating particles, and a second section which is interposed between the first section and the via conductor, including a plurality of inorganic insulating particles partly connected to each other, and a conducting portion composed of part of the via conductor which is located in gaps between the inorganic insulating particles.

First claim

1 . A wiring board, comprising:
an inorganic insulating layer having a through hole formed so as to penetrate the inorganic insulating layer in a thickness direction thereof; a conductive layer disposed on the inorganic insulating layer; and a through conductor which adheres to an inner wall of the through hole and is connected with the conductive layer, the inorganic insulating layer comprising a first section including a plurality of inorganic insulating particles partly connected to each other, and a resin portion located in gaps between the inorganic insulating particles, and a second section which is interposed between the first section and the through conductor, including a plurality of inorganic insulating particles partly connected to each other, and a conductor portion composed of part of the through conductor which is located in gaps between the inorganic insulating particles.

2 . The wiring board according to claim 1 ,
wherein the plurality of inorganic insulating particles in the first section and the second section include a plurality of first inorganic insulating particles partly connected to each other, and a plurality of second inorganic insulating particles that are greater in average particle size than the first inorganic insulating particles and are spaced away from each other, with the first inorganic insulating particles interposed therebetween.

3 . The wiring board according to claim 2 ,
wherein an average particle size of the first inorganic insulating particles falls in a range of 3 nm or above and 110 nm or below, and an average particle size of the second inorganic insulating particles falls in a range of 0.5 μm or above and 5 μm or below.

4 . The wiring board according to claim 1 , further comprising:
a first resin layer, which is smaller in thickness than the inorganic insulating layer, interposed between the inorganic insulating layer and the conductive layer while being kept in contact with the inorganic insulating layer and the conductive layer, wherein one main face of the second section of the inorganic insulating layer located on a conductive layer side is exposed from the first resin layer, and the inner wall of the through hole includes a first region defined by a side face of the first resin layer, a second region defined by the one main face of the inorganic insulating layer exposed from the first resin layer, and a third region defined by a side face of the inorganic insulating layer.

5 . The wiring board according to claim 1 , further comprising:
a second resin layer disposed on the inorganic insulating layer on an opposite side to a conductive layer side of the inorganic insulating layer while being kept in contact with the inorganic insulating layer, wherein the other main face of the second section of the inorganic insulating layer which is a main face opposite to a conductive layer side main face of the second section of the inorganic insulating layer is exposed from the second resin layer, and the inner wall of the through hole includes a fourth region defined by the other main face of the inorganic insulating layer exposed from the second resin layer and a fifth region defined by a side face of the second resin layer.

6 . The wiring board according to claim 4 ,
wherein an inclination angle of the first region relative to a penetrating direction of the through hole is greater than an inclination angle of the third region relative to the penetrating direction of the through hole.

7 . The wiring board according to claim 1 ,
wherein the insulating layer further comprises a second resin layer, which is larger in thickness than the first resin layer, disposed on the inorganic insulating layer on an opposite side to a first resin layer side of the inorganic insulating layer while being kept in contact with the inorganic insulating layer, the first resin layer comprises a first resin and a plurality of first filler particles dispersed in the first resin, the second resin layer comprises a second resin and a plurality of second filler particles dispersed in the second resin, and a content percentage of the first filler particles in the first resin layer is smaller than a content percentage of the second filler particles in the second resin layer.

8 . The wiring board according to claim 1 ,
wherein the conductive layer comprises metal foil bonded to the first resin layer, and an electroplating layer disposed on the metal foil, the metal foil comprises an adherent portion bonded to the first resin layer, and a projection protruding from the first resin layer toward the through hole, and part of the through conductor is located between the second region and the projection.

9 . A mounting structure, comprising:
the wiring board according to claim 1 ; and an electronic component mounted on the wiring board so as to be electrically connected to the conductive layer.

Assignees

• Kyocera Corp

Inventors

• Kajita Satoshi
• Hagihara Mitsuhiro
• Matsumoto Yuuhei

Classifications

• H05K2201/0116

  Porous, e.g. foam · CPC title

• H05K3/0038

  combined with laser drilling through a metal layer · CPC title

• H05K2201/0209

  Inorganic, non-metallic particles · CPC title

• H05K2201/0266

  Size distribution · CPC title

• H05K1/036

  Multilayers with layers of different types · CPC title