Circuit board

Patent metadata

Field	Value
Publication number	US-9924589-B2
Application number	US-201514980395-A
Country	US
Kind code	B2
Filing date	Dec 28, 2015
Priority date	Dec 26, 2014
Publication date	Mar 20, 2018
Grant date	Mar 20, 2018

Abstract

A circuit board includes a first insulating layer having an upper surface on which mounting regions of electronic components and wiring patterns are provided, a metal core provided on the lower surface of the first insulating layer, in such a way as to vertically overlap with the mounting regions, and a second insulating layer provided on the lower surface of the first insulating layer, around the metal core. The lower surface of the metal core is exposed from the second insulating layer, the thermal conductivities of the first insulating layer and the metal core are higher than the thermal conductivity of the second insulating layer, and the hardness of the first insulating layer is higher than the hardness of the second insulating layer. Through holes that penetrate the insulating layers and that connect wiring patterns of the insulating layers are provided.

First claim

The invention claimed is:

1. A circuit board comprising:
a first insulating layer having an upper surface on which a first mounting region of a first electronic component and a first wiring pattern is provided;
a thermal conductor provided, on a lower surface of the first insulating layer, in such a way as to vertically overlap with at least the first mounting region; and
a second insulating layer provided on the lower surface of the first insulating layer, around the thermal conductor, wherein a lower surface of the thermal conductor is exposed from the second insulating layer,
wherein thermal conductivities of the first insulating layer and the thermal conductor are higher than a thermal conductivity of the second insulating layer,
wherein a hardness of the first insulating layer is higher than a hardness of the second insulating layer, and
wherein the circuit board further comprises a first through hole penetrating the first insulating layer and the second insulating layer.

2. The circuit board according to claim 1 , wherein a thickness of the first insulating layer is thinner than a thickness of the second insulating layer.

3. The circuit board according to claim 1 , wherein the thermal conductivity of the thermal conductor is higher than the thermal conductivity of the first insulating layer.

4. The circuit board according to claim 1 , wherein the first mounting region is a plurality of the first mounting regions, the thermal conductor is provided over a wide range so as to overlap with the plurality of the first mounting regions provided on the upper surface of the first insulating layer.

5. The circuit board according to claim 1 , wherein the second insulating layer has a laminate structure, and wherein a second wiring pattern is provided on both a first inner layer present between the first insulating layer and the second insulating layer, and a second inner layer present inside the second insulating layer.

6. The circuit board according to claim 1 , wherein a second mounting region of a second electronic component and a second wiring pattern are provided on a lower surface of the second insulating layer.

7. An electronic device comprising:
the circuit board according to claim 1 ;
the first electronic component that is mounted on the first mounting region provided to the circuit board and that generates heat; and
a heat radiator that is provided so as to contact the lower surface of the thermal conductor provided to the circuit board.

8. The electronic device according to claim 7 , wherein the heat radiator is separated from a second electronic component that is mounted on the lower surface of the second insulating layer provided to the circuit board.

9. The electronic device according to claim 7 , wherein an area of a surface of each of the thermal conductor and the heat radiator facing a first insulating layer provided to the circuit board is larger than an area of the first mounting region provided to the first insulating layer, wherein a penetration hole penetrating the first insulating layer and the thermal conductor is provided at a non-overlapping position, of the first insulating layer, not overlapping the first mounting region and the first wiring pattern, and a screw hole is provided to the heat radiator in such a way as to communicate with the penetration hole, and wherein, by causing a screw member to penetrate the penetration hole from above the first insulating layer and to be screwed with the screw hole, the heat radiator is fixed to the lower surface of the thermal conductor.

Assignees

• Kasashima Masato
• Kobayashi Tomoyoshi
• Sasaki Satoru
• Ikushima Yoshihiro
• Omron Automotive Electronics

Inventors

• Kasashima Masato
• Kobayashi Tomoyoshi
• Sasaki Satoru
• Ikushima Yoshihiro

Classifications

• H05K2201/10416

  Metallic blocks or heatsinks completely inserted in a PCB · CPC title

• H05K3/4697

  having cavities, e.g. for mounting components (H05K3/4691 takes precedence) · CPC title

• H05K1/0204 Primary

  using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence) · CPC title

• H05K2201/10409

  Screws · CPC title

• H05K3/0061

  onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20) · CPC title