Computer thermal system

Patent metadata

Field	Value
Publication number	US-9913400-B2
Application number	US-201514721857-A
Country	US
Kind code	B2
Filing date	May 26, 2015
Priority date	Jun 7, 2013
Publication date	Mar 6, 2018
Grant date	Mar 6, 2018

Abstract

The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.

First claim

What is claimed is:

1. A consolidated thermal module used to uniformly secure electrical contacts of an integrated circuit (IC) to corresponding electrical contacts of an electrical connector disposed on a first surface of a printed circuit board (PCB) and to maintain the IC in uniform thermal contact with a heat transfer assembly, the consolidated thermal module positioned at a second surface of the PCB, the second surface opposite the first surface, the consolidated thermal module comprising:
a stiffener plate disposed on the second surface of the PCB;
a retaining mechanism in mechanical contact with the stiffener plate and disposed on the second surface of the PCB and comprising:
a first spring assembly capable of generating a first retaining force and secured to the IC and the heat transfer assembly by first fasteners symmetrically disposed about first midpoint of the first spring assembly such that the first retaining force is uniformly applied to the first fasteners, and
a second spring assembly capable of generating a second retaining force and in uniform and direct mechanical contact with the stiffener plate and secured to the IC and the heat transfer assembly by second fasteners symmetrically disposed about a second midpoint of the second spring assembly such that the second retaining force is uniformly applied to the second fasteners and wherein the first and second spring assemblies communicate with each other by way of a transverse member at a midline of the retaining mechanism such that the first and second retaining forces are applied uniformly to the stiffener plate.

2. The consolidated thermal module as recited in claim 1 , wherein the retaining mechanism includes a first spring and a second spring.

3. The consolidated thermal module as recited in claim 2 , wherein the first spring comprises a first portion configured to provide the first retaining force and the second spring comprises a second portion configured to provide the second retaining force.

4. The consolidated thermal module as recited in claim 1 , wherein the PCB is disposed within an internal volume that is enclosed and defined by an interior surface of a housing of a compact desktop computer, the housing characterized as having a longitudinal axis, and wherein the internal volume is symmetric about the longitudinal axis.

5. The consolidated thermal module as recited in claim 4 , wherein the heat transfer assembly comprises a heat sink asymmetrically disposed within the internal volume and having heat sink walls that cooperate to give the heat sink an overall triangular cross section that is perpendicular to the longitudinal axis.

6. The consolidated thermal module as recited in claim 5 , wherein the IC is a computing component disposed within the internal volume and supported by and in thermal contact with the heat sink.

7. The consolidated thermal module as recited in claim 6 , wherein exterior surfaces of the heat sink walls and the interior surface of the housing defines a peripheral thermal zone separate from a central thermal zone.

8. The consolidated thermal module as recited in claim 7 , further comprising an air mover arranged to move an incoming airflow received at a first opening of the housing through the internal volume and along an airflow path parallel to the longitudinal axis.

9. The consolidated thermal module as recited in claim 8 , further comprising an air splitter arranged to split the incoming airflow into a central airflow that follows a central airflow path through the central thermal zone and substantially parallel to the longitudinal axis.

10. The consolidated thermal module as recited in claim 9 , wherein the air splitter is arranged to split the incoming airflow into a peripheral airflow independent of the central airflow that follows a peripheral airflow path through the peripheral thermal zone and substantially parallel to the longitudinal axis.

11. The consolidated thermal module as recited in claim 9 , wherein the air mover combines the peripheral airflow and the central airflow into an exhaust airflow prior to moving the exhaust airflow out of the housing.

12. The consolidated thermal module as recited in claim 8 , wherein the air mover comprises:
an impeller comprising a plurality of fan blades; and
an air exhaust grill surrounding the impeller and comprising a plurality of air vents through which the exhaust airflow moves, the plurality of air vents comprising:
a plurality of ribs configured to cooperate with the plurality of fan blades to increase an axial component of the exhaust airflow, and
a plurality of stators configured to remove tangential components of the exhaust airflow passing through the air exhaust grill.

13. The consolidated thermal module as recited in claim 5 , wherein at least one of the heat sink walls comprises an exterior surface that carries the IC.

14. The consolidated thermal module as recited in claim 4 , wherein the housing has a thickness that varies uniformly from a first thickness at an opening to a reduced thickness an axial distance from the opening.

Assignees

• Apple Inc

Inventors

• Degner Brett W
• Prather Eric R
• Narajowski David H
• Liang Frank F
• Nigen Jay S
• Dybenko Jesse T
• Duke Connor R
• Whang Eugene A
• Stringer Christopher J
• Banko Joshua D
• Kalinowski Caitlin Elizabeth
• Berk Jonathan L
• Casebolt Matthew P
• Fetterman Kevin S
• Weirshauser Eric J

Classifications

• H10W40/641

  Snap-on arrangements, e.g. clips · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K5/03

  Covers · CPC title

• G06F1/182

  with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI] · CPC title

• H05K7/20172

  Fan mounting or fan specifications · CPC title