Computer thermal management

Patent metadata

Field	Value
Publication number	US-9285846-B2
Application number	US-201414297582-A
Country	US
Kind code	B2
Filing date	Jun 5, 2014
Priority date	Jun 7, 2013
Publication date	Mar 15, 2016
Grant date	Mar 15, 2016

Abstract

The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.

First claim

What is claimed is:

1. A compact computing system, comprising:
a housing having a longitudinal axis and that encloses and defines an internal volume that is symmetric about the longitudinal axis;
a heat sink having at least three walls that encloses a central thermal zone having a cross section in a shape of a polygon and that is substantially perpendicular to the longitudinal axis and comprising a fin stack in thermal contact with the walls, the fin stack comprising a cooling fin that extends from an inside surface of a first one of the walls and spans across the central thermal zone to an inside surface of at least another wall;
an air mover configured to direct an amount of air through the internal volume that includes a central airflow directed through the central thermal zone; and
a computing component carried by at least one of the walls and disposed within the internal volume and supported by and in thermal contact with the heat sink, wherein an exterior surface of at least one wall and an interior surface of the housing defines a peripheral thermal zone separate from the central thermal zone.

2. The compact computing system as recited in claim 1 , wherein the central airflow receives heat from the computing component via at least the cooling fin.

3. The compact computing system as recited in claim 2 wherein at least a portion of the central airflow moving through the fin stack has essentially no radial components.

4. The compact computing system as recited in claim 3 , wherein the air mover pulls a peripheral airflow through the peripheral thermal zone that receives heat directly from the computational component.

5. The compact computing system as recited in claim 4 , wherein the air mover combines the central airflow and the peripheral airflow into an exhaust airflow having essentially no tangential components.

6. The compact computing system as recited in claim 5 , wherein the air mover comprises:
an impeller comprising a plurality of fan blades; and
an air exhaust grill surrounding the impeller and comprising a plurality of air vents through which the exhaust airflow moves out of the compact computing system, the plurality of air vents comprising:
a plurality of ribs configured to cooperate with the plurality of fan blades to increase an axial component of the exhaust airflow, and
a plurality of stators configured to remove any tangential components of the exhaust airflow passing through the air exhaust grill.

7. The compact computing system as recited in claim 1 , wherein the housing has a shape in accordance with a cylinder.

8. The compact computing system as recited in claim 1 , wherein the polygon is a triangle.

9. The compact computing system as recited in claim 1 , further comprising:
an air passage within the internal volume that extends along an entire length of the housing.

10. The compact computing system as recited in claim 9 , wherein the air passage is parallel to the longitudinal axis.

11. The compact computing system as recited in claim 10 , wherein the air passage provides an air path that is generally parallel to the longitudinal axis for moving air that is used to cool the computational component.

Assignees

• Apple Inc

Inventors

• Degner Brett W
• Prather Eric R
• Narajowski David H
• Liang Frank F
• Nigen Jay S
• Dybenko Jesse T
• Duke Connor R
• Whang Eugene A
• Stringer Christopher J
• Banko Joshua D
• Kalinowski Caitlin Elizabeth
• Berk Jonathan L
• Casebolt Matthew P
• Fetterman Kevin S
• Weirshauser Eric J

Classifications

• H10W40/641

  Snap-on arrangements, e.g. clips · CPC title

• G06F1/185

  Mounting of expansion boards · CPC title

• H05K5/03

  Covers · CPC title

• G06F1/183

  Internal mounting support structures, e.g. for supporting printed circuit boards · CPC title

• H05K7/20163

  the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels · CPC title