Computer housing

Patent metadata

Field	Value
Publication number	US-9423840-B2
Application number	US-201514945064-A
Country	US
Kind code	B2
Filing date	Nov 18, 2015
Priority date	Jun 7, 2013
Publication date	Aug 23, 2016
Grant date	Aug 23, 2016

Abstract

A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

First claim

What is claimed is:

1. An enclosure for a computer system, comprising:
a housing formed of material that is both electrically and thermally conductive having a varying housing thickness and having a shape characterized as having a longitudinal axis and a cross section having a center point at a position on the longitudinal axis and that encloses an internal volume that is symmetric about the longitudinal axis.

2. The enclosure as recited in claim 1 , wherein the cross section is circular and wherein the cross section further comprises a radius that originates at the center point and is perpendicular to the longitudinal axis.

3. The enclosure as recited in claim 2 , wherein the radius further comprises:
an inner radius that terminates at an interior surface of the housing and having an inner radial length; and
an outer radius that terminates at an exterior surface of the housing and having an outer radial length greater than the inner radial length.

4. The enclosure as recited in claim 3 , wherein the housing thickness corresponds to a difference between the outer radial length and the inner radial length.

5. The enclosure as recited in claim 4 , wherein the outer radial length varies in accordance with the position of the center point on the longitudinal axis.

6. The enclosure as recited in claim 1 , wherein the varying housing thickness promotes uniform axial and circumferential heat transfer in the housing.

7. The enclosure as recited in claim 6 , wherein the uniform axial and circumferential heat transfer inhibits formation of a thermal hot spot in the housing.

8. An enclosure for a computer system, comprising:
a housing formed of material that is both electrically and thermally conductive having a housing wall having a housing wall thickness, the housing having a shape characterized by a longitudinal axis and a circular cross section, the circular cross section having a center point at a position on the longitudinal axis and a radius comprising a first radius that terminates at an exterior surface of the housing wall and having a first radial length, and a second radius that terminates at an interior surface of the housing wall and having a second radial length, wherein a housing wall thickness is a difference between the first and second radial lengths and that varies in accordance with the position of the center point on the longitudinal axis, wherein a first portion of the housing comprises a first end having an opening having a size and shape defined by a lip and being suitable for passing heated air and comprises a first housing wall thickness and that receives heat from the heated air passing through the opening at least by way of the lip.

9. The enclosure as recited in claim 8 , wherein first radial length is a constant value.

10. The enclosure as recited in claim 8 , wherein the second radial length is a constant value.

11. The enclosure as recited in claim 8 , the housing further comprising a second portion comprising: a second wall thickness that is less than the first wall thickness and that receives heat from the first portion.

12. The enclosure as recited in claim 11 , wherein the variation of the housing wall thickness between the first and second portions promotes uniform axial and circumferential heat transfer through the housing that further inhibits formation of a thermal hot spot in the housing.

13. A computing system, comprising:
a cylindrically shaped housing having a longitudinal axis and formed of a material that is both electrically and thermally conductive and having a housing thickness that varies smoothly from a first thickness corresponding to a first position on the longitudinal axis to a second thickness corresponding to a second position on the longitudinal axis that is away from the first position.

14. The computing system as recited in claim 13 , wherein the first thickness is greater than the second thickness.

15. The computing system as recited in claim 13 , the housing further comprising:
a cross section having a center point at a position on the longitudinal axis and further comprising a radius that originates at the center point and is perpendicular to the longitudinal axis.

16. The computing system as recited in claim 15 , wherein the radius further comprises:
an inner radius that terminates at an interior surface of the housing and having an inner radial length; and
an outer radius that terminates at an exterior surface of the housing and having an outer radial length greater than the inner radial length.

17. The computing system as recited in claim 16 , wherein the housing thickness corresponds to a difference between the outer radial length and the inner radial length.

18. The computing system as recited in claim 13 , wherein the housing encloses an internal volume that is symmetric about the longitudinal axis; and
a computational component positioned within the internal volume.

Assignees

• Apple Inc

Inventors

• Whang Eugene A
• Stringer Christopher J
• Degner Brett W
• Narajowski David H
• Kessler Patrick
• Prather Eric R
• Kalinowski Caitlin Elizabeth
• Stagnaro Adam T
• Mcbroom Daniel L
• Casebolt Matthew P
• Mcbroom Michael D

Classifications

• H10W40/641

  Snap-on arrangements, e.g. clips · CPC title

• G06F1/182

  with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI] · CPC title

• H05K7/20145

  Means for directing air flow, e.g. ducts, deflectors, plenum or guides · CPC title

• G06F1/181 Primary

  Enclosures (for portable computers G06F1/1613) · CPC title

• G06F1/20 Primary

  Cooling means · CPC title