Low cost, high strength electronics module for airborne object

Patent metadata

Field	Value
Publication number	US-8942005-B2
Application number	US-47031109-A
Country	US
Kind code	B2
Filing date	May 21, 2009
Priority date	May 21, 2009
Publication date	Jan 27, 2015
Grant date	Jan 27, 2015

Abstract

An electronics module is provided for utilization onboard an airborne object. In one embodiment, the electronics module includes a housing having a cavity therein, a first printed circuit board (PCB) disposed in the cavity, a second PCB disposed in the cavity above the first PCB, and a supportive interconnect structure. The supportive interconnect structure includes a substantially annular insulative body and a plurality of vias. The substantially annular insulative body extends around an inner circumferential portion of the housing between the first PCB and the second PCB to support the second PCB and to axially space the second PCB from the first PCB. The plurality of vias is formed through the substantially annular insulative body and electrically couples the first PCB to the second PCB.

First claim

What is claimed is:

1. An electronics module for utilization onboard an airborne object, the electronics module comprising:
a housing having a cavity therein;
a first printed circuit board (PCB) disposed in the cavity, and supporting a first plurality of electronic devices having a first maximum height;
a second PCB disposed in the cavity above the first PCB, and supporting a second plurality of electronic devices having a second maximum height different from the first maximum…

Assignees

• Geswender Chris E
• Raytheon Co

Inventors

• Geswender Chris E

Classifications

• H05K2201/09027

  Electricity · mapped topic

• F42B15/08

  Mechanical Engineering · mapped topic

• H05K7/1434

  Electricity · mapped topic

• H05K2201/10378

  Electricity · mapped topic

• H05K2201/2018

  Electricity · mapped topic