Reflective deposition rings and substrate processing chambers incorporating same

Patent metadata

Field	Value
Publication number	US-9905443-B2
Application number	US-201213598828-A
Country	US
Kind code	B2
Filing date	Aug 30, 2012
Priority date	Mar 11, 2011
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

Apparatus for improving temperature uniformity across a substrate are provided herein. In some embodiments, a deposition ring for use in a substrate processing system to process a substrate may include an annular body having a first surface, an opposing second surface, and a central opening passing through the first and second surfaces, wherein the second surface is configured to be disposed over a substrate support having a support surface to support a substrate having a given width, and wherein the opening is sized to expose a predominant portion of the support surface; and wherein the first surface includes at least one reflective portion configured to reflect heat energy toward a central axis of the annular body, wherein the at least one reflective portion has a surface area that is about 5 to about 50 percent of a total surface area of the first surface.

First claim

The invention claimed is:

1. A deposition ring for use in a substrate processing system to process a substrate, comprising:
an annular body having a first surface, an opposing second surface, and a central opening passing through the first and second surfaces,
wherein the second surface is configured to be disposed over a substrate support having a support surface to support a substrate having a given width;
wherein the opening is sized to expose a predominant portion of the support surface;
wherein the first surface comprises:
at least one reflective portion angled toward a central axis of the annular body and configured to reflect heat energy toward the central axis of the annular body, wherein the at least one reflective portion has a surface area that is about 5 to about 50 percent of a total surface area of the first surface;
a sloped surface disposed radially inward of the at least one reflective portion, wherein the sloped surface is annular; and
a flat portion disposed proximate an outer periphery of the deposition ring, the flat portion having an upper surface disposed below a radially outermost portion of the reflective portion.

2. The deposition ring of claim 1 , wherein the at least one reflective portion is coated with a reflective material.

3. The deposition ring of claim 1 , wherein the annular body further comprises a groove disposed in the first surface and configured to receive a buildup of deposition material during substrate processing.

4. The deposition ring of claim 3 ,
wherein the sloped surface is disposed proximate the groove,
wherein the sloped surface is configured to position the substrate over the central opening when the substrate is present, and
wherein the sloped surface forms a radially outer wall of the groove and extends above a radially inner wall of the groove.

5. The deposition ring of claim 1 , wherein the first surface has a roughness of about 80 to about 100 micro-inches RMS.

6. The deposition ring of claim 1 , wherein the deposition ring has a diameter of about 12 to about 15 inches.

7. The deposition ring of claim 1 , wherein a slope of the at least one reflective portion is up to about 30 degrees.

8. The deposition ring of claim 1 , wherein the annular body includes a plurality of reflector surfaces, each of which are angled to reflect heat energy towards the substrate when present.

9. The deposition ring of claim 1 , wherein the annular body further comprises a first step connecting the second surface to an inner diameter of the annular body.

10. A deposition ring for use in a substrate processing system to process a substrate, comprising:
an annular body having a first surface, an opposing second surface, and a central opening passing through the first and second surfaces, wherein the second surface is configured to be disposed over a substrate support having a support surface to support a substrate having a given width, and wherein the opening is sized to expose a predominant portion of the support surface;
wherein the first surface comprises:
at least one reflective portion angled toward a central axis of the annular body and configured to reflect heat energy toward the central axis of the annular body, wherein the at least one reflective portion has a surface area that is at least 5 percent of a total surface area of the first surface;
a sloped surface disposed radially inward of the at least one reflective portion, wherein the sloped surface is annular; and
a flat portion disposed proximate an outer periphery of the deposition ring, the flat portion having an upper surface disposed below a radially outermost portion of the reflective portion.

11. The deposition ring of claim 10 , further comprising a groove recessed into the first surface of the annular body extending towards the second surface, wherein the groove is configured to receive build-up of deposition material during substrate processing.

12. The deposition ring of claim 11 , wherein the sloped surface is disposed proximate the groove, wherein the sloped surface is configured to position the substrate over the central opening when the substrate is present, and wherein the sloped surface forms a radially outer wall of the groove and extends above a radially inner wall of the groove.

13. A substrate processing chamber, comprising:
a substrate support having a support surface to support a substrate having a given width;
a radiant energy source positioned at a peripheral region of the substrate processing chamber;
a reflector disposed around the radiant energy source; and a deposition ring comprising:
an annular body having a first surface, an opposing second surface, and a central opening passing through the first and second surfaces, wherein the second surface is configured to be disposed over the substrate support, and wherein the opening is sized to expose a predominant portion of the support surface;
wherein the first surface comprises:
at least one reflective portion angled toward a central axis of the annular body and configured to reflect heat energy toward the central axis of the annular body, wherein the at least one reflective portion has a surface area that is at least 5 percent of a total surface area of the first surface;
a sloped surface disposed radially inward of the at least one reflective portion, wherein the sloped surface is annular; and
a flat portion disposed proximate an outer periphery of the deposition ring, the flat portion having an upper surface disposed below a radially outermost portion of the reflective portion.

14. The substrate processing chamber of claim 13 , wherein the annular body of the deposition ring further comprises a groove disposed in the first surface and configured to receive a build-up of deposition material during substrate processing, wherein the sloped surface is disposed proximate the groove, wherein the sloped surface is configured to position the substrate over the central opening when the substrate is present, and wherein the sloped surface forms a radially outer wall of the groove and extends above a radially inner wall of the groove.

15. The substrate processing chamber of claim 14 , wherein the at least one reflective portion of the deposition ring is coated with a reflective material.

16. The substrate processing chamber of claim 13 , the deposition ring further comprising an first surface with a roughness of about 80 to about 100 micro-inches RMS.

17. The substrate processing chamber of claim 13 , wherein the reflector further comprises an upper reflector and a lower reflector.

18. The substrate processing chamber of claim 17 , wherein the first surface of the deposition ring is an extension of the lower reflector.

Assignees

• Subramani Anantha K
• Ranish Joseph M
• Yuan Xiaoxiong
• Goel Ashish
• Lee Joung Joo
• Applied Materials Inc

Inventors

• Subramani Anantha K
• Ranish Joseph M
• Yuan Xiaoxiong
• Goel Ashish
• Lee Joung Joo

Classifications

• H10P72/7612

  characterised by lifting arrangements, e.g. lift pins · CPC title

• H10P72/7611

  characterised by edge profile or support profile · CPC title

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0436 Primary

  mainly by radiation · CPC title

• C23C16/481

  by radiant heating of the substrate · CPC title