Surface treating apparatus and plating tank

Patent metadata

Field	Value
Publication number	US-9657406-B2
Application number	US-201213526265-A
Country	US
Kind code	B2
Filing date	Jun 18, 2012
Priority date	Jun 30, 2011
Publication date	May 23, 2017
Grant date	May 23, 2017

Abstract

To prevent a plate-like work in a plating tank from swinging to improve quality of plating and prevent dropout or damages of a printed circuit board during transportation. A plating tank 2 a includes an upper guide rail 11 that is provided above the plating tank 2 a and transports a transport hanger 15 a in a moving direction and a lower guide rail 14 that is provided inside the plating tank 2 a and generates an attractive force against a lower clamp 49 of the transport hanger 15 a . In the plating tank 2 a , an attractive force is generated while performing plate processing to pull the lower clamp 49 of the transport hanger 15 a downward, thereby giving tension to a plate-like work W.

First claim

What is claimed is:

1. A surface treating apparatus for electroplating, comprising:
a transport hanger that transports a thin processing object;
a plating tank having a tank body that stores a plating solution; and
a rise-and-fall mechanism that lowers the transport hanger loaded with the thin processing object into the plating tank and lifts the transport hanger from the plating tank after performing plate processing on the thin processing object,
wherein the transport hanger includes an upper gripper that grips an upper part of the thin processing object and a lower gripper that grips a lower part of the thin processing object, and the plating tank includes an upper guide rail that transports the transport hanger in a predetermined moving direction and a member that is provided at a predetermined position of the tank body and that generates an attractive force against the lower gripper of the transport hanger, further wherein a magnetic material is provided within a bottom part of the transport hanger, and the member generates a downward attractive force to stretch the thin processing object, the transport hanger further comprising a plurality of frame-body members interconnecting the upper gripper and the lower gripper each frame-body member having an associated elastic member, wherein the thin processing object is configured to receive a load from the lower gripper through an interaction between the elastic members and the member that generates the downward attractive force, and the lower gripper of the transport hanger moves, from a first position of use further from the member, downward, to a second position of use, toward and closer to the member against the force of the elastic member to place the processing object in the second position of use in a stretched state.

2. A plating tank for electroplating a thin processing object, comprising:
a tank body that is provided to extend in a moving direction the thin processing object and store a plating solution;
a positive electrode provided in the tank body;
a transport hanger moving in the moving direction while holding the thin processing object and including an upper gripper and a lower gripper for respectively gripping the thin processing object at an upper and a lower parts thereof;
an upper guide rail that is provided above the tank body that transports the transport hanger in the moving direction; and
a member that is provided at a predetermined position of the tank body that generates an attractive force against the lower gripper of the transport hanger, further wherein a magnetic material is provided within a bottom part of the transport hanger and the member generates a downward attractive force to stretch the thin processing object, the transport hanger further comprising a plurality of frame-body members interconnecting the upper gripper and the lower gripper, each frame-body member having an associated elastic member, wherein the thin processing object is configured to receive a load from the lower gripper through an interaction between the elastic members and the member that generates the downward attractive force, and the lower gripper of the transport hanger moves, from a first position of use further from the member, downward, to a second position of use toward and closer to the member against the force of the elastic member to place the processing object in the second position of use in a stretched state.

3. The plating tank of claim 2 , wherein each frame-body member connects the upper gripper and the lower gripper to form a frame body.

4. The plating tank of claim 3 , wherein each frame-body member of the transport hanger is integrally coupled to the upper gripper, and the lower gripper of the transport hanger is adapted to be movable relative to each respective frame-body member.

5. The plating tank of claim 3 , wherein each frame-body member of the transport hanger is integrally coupled to the lower gripper, and the upper gripper of the transport hanger is adapted to be movable relative to each respective frame-body member.

6. The plating tank of claim 2 , wherein the thin processing object receives a load from the lower gripper via the elastic member and is balanced at a predetermined position to have no tension before an attractive force is generated between the member that generates an attractive force and the lower gripper of the transport hanger, and the lower gripper of the transport hanger stretches relative to the upper gripper against the force of the elastic member to make the thin processing object be in the stretched state after an attractive force is generated between the member that generates an attractive force and the lower gripper of the transport hanger.

7. The plating tank of claim 2 , wherein the transport hanger includes a lower fixing member for fixing a plurality of the lower grippers, and a hollow is provided inside the lower fixing member.

8. The plating tank of claim 2 , wherein a metallic piece is provided in the lower gripper of the transport hanger, a lower guide rail as the member that generates an attractive force against the lower gripper of the transport hanger is provided at a predetermined position in the tank body, and permanent magnets are continuously provided in the lower guide rail along the direction of transportation.

9. The plating tank of claim 8 , wherein a guide groove extending in the direction of transportation is provided on the lower guide rail, and a hard magnetic material is placed on the bottom of the guide groove.

10. The plating tank of claim 8 , wherein the spacing between the upper gripper and the lower gripper can be adjusted by changing the length of the frame-body member corresponding to the length of the thin processing object, and the vertical position of the lower guide rail can be adjusted corresponding to the length of the processing object.

11. The plating tank of claim 2 , wherein at least the upper gripper out of the upper gripper and lower gripper of the transport hanger is structured to make the current flow path symmetrical between both sides of the thin processing object.

12. The plating tank of claim 11 , wherein at least the upper gripper of the upper gripper and lower gripper of the transport hanger is formed symmetrical with respect to the thin processing object and corresponding parts on each side are made of the same material.

13. The plating tank of claim 2 , further comprising a spouter for spouting the plating solution toward the thin processing object and an electric field restrictor that is interposed between the spouter and the thin processing object and has multiple long holes formed to be oriented to the processing object.

14. The plating tank of claim 13 , wherein a long hole at a part to which the spouted plating solution is spouted from the spouter is formed smaller than a long hole at a part which is not hit by the spouted plating solution.

15. The plating tank of claim 13 , wherein the electric field restrictor is notched following the shape of the upper gripper of the transport hanger.

16. The plating tank of claim 13 , further comprising an electric field restrictor that is interposed between the spouter and the thin processing object and has multiple long holes formed to be oriented to the thin processing object and two conductive porous plates that sandwich the electric field restrictor therebetween and are electrically connected with each other.

17. A surface treating apparatus, comprising:
a first treatment tank in which a thin processing object, in a stretched state, is required to have a plating solution treatment;

Assignees

• Asa Fujio
• Mizumoto Junji
• Uemura Kogyo Kk

Inventors

• Asa Fujio
• Mizumoto Junji

Classifications

• C25D21/10

  Agitating of electrolytes; Moving of racks · CPC title

• C25D5/08

  Electroplating with moving electrolyte e.g. jet electroplating {(using locally applied jets of electrolyte C25D5/026)} · CPC title

• C25D17/008 Primary

  Current shielding devices · CPC title

• C25D17/10

  Electrodes {, e.g. composition, counter electrode} · CPC title

• C25D17/005

  Contacting devices · CPC title