Copper electroplating solution and method of copper electroplating

Patent metadata

Field	Value
Publication number	US-9637833-B2
Application number	US-201213726251-A
Country	US
Kind code	B2
Filing date	Dec 24, 2012
Priority date	Dec 22, 2011
Publication date	May 2, 2017
Grant date	May 2, 2017

Abstract

A copper plating solution which contains compounds with the structure —X—S—Y— where X and Y are, independently of each other, atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen, and X and Y can be the same only if they are carbon atoms and aliphatic semialdehydes. By using this copper electroplating solution it is possible to form good filled vias without worsening the appearance of the plating.

First claim

What is claimed is:

1. A method of copper electroplating comprising:
a) providing a base comprising vias;
b) providing an acid copper electroplating solution comprising copper sulfate, copper cyanide or copper pyrophosphate, 10 g/L to 400 g/L sulfuric acid, 1.0×10 −4 to 1.0×10 −1 mol/L semialdehyde succinate, and a compound selected from the group consisting of:
M-SO 3 —(CH 2 ) a —S—(CH 2 ) b —SO 3 -M;  (1)

M-SO 3 —(CH 2 ) a —O—CH 2 —S—CH 2 —O—(CH 2 ) b —SO 3 -M;  (2)

M-SO 3 —(CH 2 ) a —S—S —(CH 2 ) b —SO 3 -M;  (3)

M-SO 3 —(CH 2 ) a —O—CH 2 —S—S —CH 2 —O—(CH 2 ) b —SO 3 -M;  (4)

M-SO 3 —(CH 2 ) a —S—C(═S)—S—(CH 2 ) b —SO 3 -M;  (5)

M-SO 3 —(CH 2 ) a —O—CH 2 —S—C(═S)—S—CH 2 —O—(CH 2 ) b —SO 3 -M;  (6)

A-S—(CH 2 ) a —SO 3 -M; and  (7)

A-S—CH 2 —O—(CH 2 ) a —SO 3 -M,  (8)

wherein a and b are integers from 3 to 8, M is hydrogen or an alkali metal element, and A is a hydrogen atom, (C 1 —C 10 )alkyl group, aryl group, a chain or cyclic amine compound formed from 1-6 nitrogen atoms, 1-20carbon atoms and a plurality of hydrogen atoms or a heterocyclic compound formed from 1-2 sulfur atoms, 1-6 nitrogen atoms, 1-20 carbon atoms, and a plurality of hydrogen atoms;
c) immersing the base comprising the vias in the acid copper electroplating solution; and
d) electroplating copper on the base and filling the vias with copper.

2. The method of claim 1 , wherein the semialdehyde succinate is in amounts of 1.0×10 −3 to 1.0×10 −2 mol/L.

Assignees

• Rohm & Haas Elect Mat

Inventors

• Saito Matsuko
• Sakai Makoto
• Hayashi Shinjiro

Classifications

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• H10W20/023

  the interconnections being through-semiconductor vias · CPC title

• H10W20/0261

  characterised by the filling method or the material of the conductive fill · CPC title

• H05K2201/09563

  Metal filled via · CPC title

• H05K2201/0959

  Plated through-holes or plated blind vias filled with insulating material · CPC title