Touch panel and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9900995-B2
Application number	US-201213978178-A
Country	US
Kind code	B2
Filing date	Jan 3, 2012
Priority date	Jan 3, 2011
Publication date	Feb 20, 2018
Grant date	Feb 20, 2018

Abstract

Provided is a method for manufacturing a touch panel. In the method, a substrate is prepared, a transparent electrode is formed on the substrate, an interconnection electrode material is applied to the substrate by printing, an interconnection electrode is formed by drying the interconnection electrode material, and a circuit board is disposed on the interconnection electrode.

First claim

The invention claimed is:

1. A method for manufacturing a touch panel, comprising:
preparing a substrate comprising an effective region and a dummy region;
forming an outer dummy layer having a black pigment on the dummy region surrounding a first side, a second side, a third side, and a fourth side of the effective region of the substrate;
forming a first transparent electrode in the effective region, the first transparent electrode extending in a first direction into the dummy region of the substrate to completely pass through the dummy region of the substrate;
forming a second transparent electrode in the effective region, the second transparent electrode extending in a second direction crossing the first direction into the dummy region of the substrate to completely pass through the dummy region of the substrate;
applying an interconnection electrode material comprising a silver (Ag) paste to at least one of the first transparent electrode and second transparent electrode by printing such that only a single layer of the interconnection electrode material is formed;
forming an interconnection electrode having a thickness in a range of 1 μm to 10 μm and a width in a range of 30 μm to 100 μm by drying the interconnection electrode material at a temperature between 150° C. and 200° C.;
forming a circuit board on the interconnection electrode; and
forming an anti-scattering film on the first transparent electrode, the second transparent electrode, the interconnection electrode, and the circuit board, the anti-scattering film filling areas between the first and second transparent electrodes;
wherein one end of the interconnection electrode connected to at least one of the first transparent electrode and second transparent electrode has a first width, and the other end of the interconnection electrode opposite to the one end has a second width;
wherein the first width is greater than the second width, and
wherein the interconnection electrode comprises a first bent portion and a second bent portion, the first bent portion having a shape of “T”.

2. The method according to claim 1 , wherein the applying of the interconnection electrode material is performed by a method including at least one of gravure offset printing, reverse offset printing, screen printing, and gravure printing.

3. The method according to claim 1 , wherein the interconnection electrode material is dried by at least one of a hot-air drying method and an infrared drying method.

4. The method according to claim 1 , wherein the circuit board is directly brought into contact with the interconnection electrode.

5. A touch panel comprising:
a substrate comprising an effective region and a dummy region;
wherein the dummy region surrounds a first side, a second side, a third side, and a fourth side of the effective region;
an outer dummy layer only disposed on the dummy region of the substrate, wherein a bottom surface of the outer dummy layer is in direct contact with the substrate;
a transparent electrode on the effective region of the substrate and in direct contact with the substrate,
wherein the transparent electrode is in direct contact with the outer dummy layer on the dummy region of the substrate,
wherein the transparent electrode extends from the effective region to the dummy region,
wherein the transparent electrode is disposed at a side surface and a top surface of the outer dummy layer,
the transparent electrode covering the side surface of the outer dummy layer and the top surface of the outer dummy layer;
an interconnection electrode connected to the transparent electrode, the interconnection electrode being formed with only a single layer;
a circuit board connected to the interconnection electrode; and
an anti-scattering film covering the transparent electrode, the interconnection electrode, and the circuit board;
wherein one surface of the interconnection electrode is in direct contact with the transparent electrode, and the other surface opposite to the one surface of the interconnection electrode is in direct contact with the circuit board;
wherein the interconnection electrode and the circuit board are only disposed in the dummy region,
wherein the circuit board includes a flexible printed circuit board;
wherein the interconnection electrode comprises a paste having an Ag powder, an epoxy-containing binder, and an ether-containing material;
wherein the interconnection electrode has a thickness between 1 μm and 10 μm,
wherein the interconnection electrode has a width between 30 μm and 100 μm,
wherein the transparent electrode comprises a first transparent electrode and a second transparent electrode,
wherein the first transparent electrode is disposed in the effective region and extends in a first direction into the dummy region to completely pass through the dummy region of the substrate,
wherein the second transparent electrode is disposed in the effective region and extends in a second direction crossing the first direction into the dummy region to completely pass through the dummy region of the substrate,
wherein the outer dummy layer comprises a black pigment,
wherein the transparent electrode comprises material different from that of the interconnection electrode,
wherein the transparent electrode has a light transmittance greater than the interconnection electrode,
wherein the paste comprises 60 to 85 parts by weight of the Ag powder per 100 parts by weight of the paste,
wherein the paste comprises 5 to 15 parts by weight of the binder per 100 parts by weight of the paste,
wherein the paste comprises 10 to 25 parts by weight of the ether-containing material per 100 parts by weight of the paste, and
wherein the anti-scattering film is disposed in the effective region between a plurality of patterns of the transparent electrode, the anti-scattering film filling areas between the first and second transparent electrodes;
wherein one end of the interconnection electrode connected to at least one of the first transparent electrode and second transparent electrode and has a first width, and the other end of the interconnection electrode opposite to the one end has a second width;
wherein the first width is greater than the second width, and
wherein the interconnection electrode comprises a first bent portion and a second bent portion, the first bent portion having a shape of “T”.

6. The touch panel according to claim 5 , wherein the transparent electrode comprises indium tin oxides.

7. The touch panel according to claim 5 , wherein the transparent electrode comprises copper oxides.

8. The touch panel according to claim 5 , wherein the transparent electrode comprises carbon nano tubes.

Assignees

• Lee Dong Youl
• You Young Sun
• Chai Kyoung Hoon
• Noh Young Jin
• Lee Yong Jin
• Lee Sun Young
• Lg Innotek Co Ltd

Inventors

• Lee Dong Youl
• You Young Sun
• Chai Kyoung Hoon
• Noh Young Jin
• Lee Yong Jin
• Lee Sun Young

Classifications

• H05K3/46 Primary

  Manufacturing multilayer circuits · CPC title

• H05K1/0298

  Multilayer circuits · CPC title

• G06F2203/04103

  Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title

• G06F2203/04112

  Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material · CPC title

• G06F3/044

  by capacitive means · CPC title