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Manufacturing method for multi-layer circuit board
US9095083B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9095083-B2 |
| Application number | US-201314074655-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 7, 2013 |
| Priority date | Nov 7, 2013 |
| Publication date | Jul 28, 2015 |
| Grant date | Jul 28, 2015 |
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Abstract
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A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having a first via penetrating the substrate is provided. Next, a patterned circuit layer is formed on a surface of the substrate by using the first via as an alignment target. The first patterned circuit layer includes a first concentric-circle pattern surrounding the first via. Next, a first stacking layer is formed on the surface. Then, a first through hole penetrating regions where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected on the first stacking layer and the substrate is formed. Next, a second stacking layer is formed on the first stacking layer. Afterward, a second through hole penetrating regions where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected on of the first, the second stacking layers and the substrate is formed.
First claim
Opening claim text (preview).
What is claimed is: 1. A manufacturing method for a multi-layer circuit board, comprising: providing a substrate having a first via penetrating the substrate; forming a first patterned circuit layer on a surface of the substrate by using the first via as an alignment target, and the first patterned circuit layer including a first concentric-circle pattern surrounding the first via; forming a first stacking layer on the surface and covering the first patterned circuit layer, an…
Assignees
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Classifications
Electricity · mapped topic
- H05K1/0298Primary
Electricity · mapped topic
Electricity · mapped topic
Operations & Transport · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9095083B2 cover?
- A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having a first via penetrating the substrate is provided. Next, a patterned circuit layer is formed on a surface of the substrate by using the first via as an alignment target. The first patterned circuit layer includes a first concentric-circle pattern surrounding the first via. Next, a fi…
- Who is the assignee on this patent?
- Unimicron Technology Corp
- What technology area does this patent fall under?
- Primary CPC classification H05K1/0298. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jul 28 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).