Method of manufacturing a wiring board having via structures

Patent metadata

Field	Value
Publication number	US-9107314-B2
Application number	US-201313799221-A
Country	US
Kind code	B2
Filing date	Mar 13, 2013
Priority date	Mar 16, 2012
Publication date	Aug 11, 2015
Grant date	Aug 11, 2015

Abstract

A method of manufacturing a wiring board includes: forming an outer through hole in a core substrate; filling the outer through hole with an insulation resin; forming a first conductive layer on a surface of the insulation resin at a portion where a core connecting via is formed; forming a land around the first conductive layer; laminating the wiring layer on the core substrate after the forming of the first conductive layer and the forming of the land; forming an inner through hole having a smaller diameter than that of the outer through hole and penetrating through the core substrate and the wiring layer so as to penetrate through the insulation resin; and coating a first conductive film on an inner wall surface of the inner through hole, in which the core substrate and the first conductive film are electrically connected through the first conductive layer and the land.

First claim

What is claimed is:

1. A method of manufacturing a wiring board including a core substrate having conductivity and a plurality of penetrating-through hole vias, the method comprising:
forming an outer through hole that penetrates through the core substrate at a portion of the core substrate where a penetrating-through hole via is to be formed;
filling the outer through hole with an insulation resin;
forming a first conductive layer on a surface portion of the insulation resin…

Assignees

• Fujitsu Ltd

Inventors

• Yoshimura Hideaki

Classifications

• H05K3/4608

  Electricity · mapped topic

• H05K3/445

  Electricity · mapped topic

• H05K1/115 Primary

  Electricity · mapped topic

• H05K3/425

  Electricity · mapped topic

• H05K3/4038

  Electricity · mapped topic