Capacitance monitoring using X-ray diffraction

Patent metadata

Field	Value
Publication number	US-9870960-B2
Application number	US-201414575134-A
Country	US
Kind code	B2
Filing date	Dec 18, 2014
Priority date	Dec 18, 2014
Publication date	Jan 16, 2018
Grant date	Jan 16, 2018

Abstract

A method includes measuring a difference between a primary X-ray diffraction peak and a secondary X-ray diffraction peak, the primary X-ray diffraction peak corresponds to an unstrained portion of a semiconductor substrate and the secondary X-ray diffraction peak corresponds to a strained portion of the semiconductor substrate, the difference between the primary X-ray diffraction peak and the secondary X-ray diffraction peak includes a delta shift peak that corresponds to changes in a crystal lattice caused by a stress applied to the strained portion of the semiconductor substrate, the delta shift peak includes variations in a deep trench capacitance.

First claim

The invention claimed is:

1. A method comprising:
measuring a difference between a primary X-ray diffraction peak and a secondary X-ray diffraction peak, the primary X-ray diffraction peak corresponds to an unstrained portion of a semiconductor substrate and the secondary X-ray diffraction peak corresponds to a strained portion of the semiconductor substrate,
wherein the difference between the primary X-ray diffraction peak and the secondary X-ray diffraction peak comprises a delta shift peak that corresponds to changes in a crystal lattice caused by a stress applied to the strained portion of the semiconductor substrate,
wherein the delta shift peak comprises variations in a deep trench capacitance.

2. The method of claim 1 , wherein measuring the difference between the primary X-ray diffraction peak and the secondary X-ray diffraction peak comprises determining the delta shift peak after depositing a dielectric material in the deep trench.

3. The method of claim 1 , further comprising:
estimating dislocations in the crystal lattice of the semiconductor substrate caused during a high temperature annealing process based on the difference between the primary X-ray diffraction peak and the secondary X-ray diffraction peak.

4. A method comprising:
forming a deep trench on a substrate;
conducting a first X-ray diffraction measurement on the substrate, wherein a first X-ray diffraction peak is observed in the the first X-ray diffraction measurement;
depositing a high-k dielectric material on the substrate and in the deep trench;
conducting a second X-ray diffraction measurement on the substrate, wherein a second X-ray diffraction peak is observed in the second X-ray diffraction measurement;
measuring a difference between a center of the first X-ray diffraction peak and a center of the second X-ray diffraction peak, wherein the difference between the center of the first X-ray diffraction peak and the center of the second X-ray diffraction peak comprises a delta peak shift;
correlating, using a database, a plurality of previously measured delta peak shift and deep trench capacitance values to obtain a correlation curve, wherein a lower capacitance limit and an upper capacitance limit are set in the correlation curve based on the database; and
comparing to the correlation curve the delta peak shift to determine a deep trench capacitance value, wherein continuing processing of the substrate depends on the deep trench capacitance value being above the lower capacitance limit and below the upper capacitance limit set in the correlation curve.

5. The method of claim 4 , wherein the first X-ray diffraction measurement is conducted on an area of the substrate without the deep trench.

6. The method of claim 5 , wherein the area of the substrate without the deep trench comprises an unstrained region of the substrate.

7. The method of claim 4 , wherein the second X-ray diffraction measurement is conducted on an area of the substrate including the deep trench.

8. The method of claim 7 , wherein the area of the substrate including the deep trench comprises a strained region of the substrate.

9. The method of claim 4 , wherein measuring the difference between the center of the first X-ray diffraction peak and the center of the second X-ray diffraction peak comprises estimating changes in a crystal lattice of the substrate caused by a stress applied during deposition of the high-k dielectric material in the deep trench.

10. The method of claim 4 , wherein the substrate comprises a silicon-containing semiconductor material.

11. The method of claim 4 further comprising:
conducting X-ray diffraction measurements before and after a high temperature annealing process on the substrate;
measuring the delta peak shift between X-ray diffraction measurements;
correlating, using a database, a plurality of previously measured delta peak shifts and known device leakage values to obtain a correlation curve, wherein an upper limit of device leakage is set in the correlation curve based on the database; and
comparing the delta peak shift to the correlation curve, wherein continuing processing of the substrate depends on a delta peak shift value corresponding to a device leakage value below the upper limit of device leakage.

12. The method of claim 11 , wherein the high temperature annealing process causes dislocations in a crystal lattice of the substrate.

13. A computer program product comprising:
a computer readable non-transitory article of manufacture tangibly embodying computer readable instructions which, when executed, cause a computer to carry out a method comprising:
conducting a first X-ray diffraction measurement on a substrate before forming a deep trench in the substrate, wherein a first X-ray diffraction peak is observed in the first X-ray diffraction measurement;
conducting a second X-ray diffraction measurement on the substrate after depositing a high-k dielectric material in the deep trench, wherein a second X-ray diffraction peak is observed in the second X-ray diffraction measurement;
measuring a difference between a center of the first X-ray diffraction peak and a center of the second X-ray diffraction peak, wherein the difference between the center of the first X-ray diffraction peak and the center of the second X-ray diffraction peak comprises a delta peak shift;
correlating, using a database, a plurality of previously measured delta peak shift and deep trench capacitance values to obtain a correlation curve, wherein a lower capacitance limit and an upper capacitance limit are set in the correlation curve based on the database; and
comparing to the correlation curve the delta peak shift to determine a deep trench capacitance value, wherein continuing processing of the substrate depends on the deep trench capacitance value being above the lower capacitance limit and below the upper capacitance limit set in the correlation curve.

14. The computer program product of claim 13 , wherein the first X-ray diffraction measurement is conducted on an area of the substrate without the deep trench.

15. The computer program product of claim 14 , wherein the area of the substrate without the deep trench comprises an unstrained region of the substrate.

16. The computer program product of claim 13 , wherein the second X-ray diffraction measurement is conducted on an area of the substrate including the deep trench.

17. The computer program product of claim 16 , wherein the area of the substrate including the deep trench comprises a strained region of the substrate.

18. The computer program product of claim 13 , wherein measuring the difference between the center of the first X-ray diffraction peak and the center of the second X-ray diffraction peak comprises estimating changes in a crystal lattice of the substrate caused by a stress applied during deposition of the high-k dielectric material.

19. The computer program product of claim 13 further comprising:
conducting X-ray diffraction measurements before and after a high temperature annealing process on the substrate;
measuring the delta peak shift between X-ray diffraction measurements;
correlating, using a database, a plurality of previously measured delta peak shifts and known device leakage values to obtain a correlation curve, wherein an upper limit of device leakage is set in the correlation curve based on the database; and
comparing the delta peak shift to the correlation curve, wherein continuing processing of the substrate depends on a delta peak shift value corresponding to a device

Assignees

• IBM

Inventors

• Kang Donghun
• Kohli Kriteshwar K
• Kwon Oh-Jung
• Madan Anita
• Murray Conal E

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P74/207 Primary

  Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics · CPC title

• H01L22/12

  Electricity · mapped topic

• H01L22/14 Primary

  Electricity · mapped topic

• G01R31/2656

  using non-ionising electromagnetic radiation, e.g. optical radiation · CPC title