Semiconductor wafer inspection apparatus and semiconductor wafer inspection method

Patent metadata

Field	Value
Publication number	US-9869715-B2
Application number	US-201615236297-A
Country	US
Kind code	B2
Filing date	Aug 12, 2016
Priority date	Dec 16, 2014
Publication date	Jan 16, 2018
Grant date	Jan 16, 2018

Abstract

The present invention provides a semiconductor wafer inspection apparatus and a semiconductor wafer inspection method that can suppress warpage in a semiconductor wafer due to a temperature difference between the mounting surface of a table and the semiconductor wafer. In a prober of the present invention, a semiconductor wafer is heated to have a second temperature which is equal to or lower than a first temperature in a preheating step using an oven, and then the semiconductor wafer is placed on a mounting surface of a table which is heated to the first temperature. Thus, because a temperature difference between the mounting surface of the table and the semiconductor wafer is reduced in the prober, it is possible to suppress warpage in the semiconductor wafer that occurs right after the semiconductor wafer is placed on the mounting surface.

First claim

What is claimed is:

1. A semiconductor wafer inspection apparatus which brings a probe into contact with a semiconductor device on a semiconductor wafer placed on a heated table and inspects electric characteristics of the semiconductor device, comprising:
a preheating heater configured to preheat the semiconductor wafer; and
a conveyance arm configured to convey the semiconductor wafer to the preheating heater and to convey the semiconductor wafer which has been preheated by the preheating heater to the table, wherein
the preheating heater preheats the semiconductor wafer while the semiconductor wafer is held by the conveyance arm, a first portion of the conveyance arm is disposed within the preheating heater, and a second portion of the conveyance arm is disposed outside the preheating heater.

2. The semiconductor wafer inspection apparatus according to claim 1 , wherein
the preheating heater preheats the semiconductor wafer in a position separated from the table with heat propagated by convection or radiation from the table in a state where the semiconductor wafer is held by the conveyance arm.

3. The semiconductor wafer inspection apparatus according to claim 1 , wherein the preheating heater comprises:
a housing having an entrance/exit for the semiconductor wafer; and
a heater configured to heat internal space of the housing.

4. The semiconductor wafer inspection apparatus according to claim 1 , wherein
the conveyance arm is configured to rotate for receiving and conveying the semiconductor wafer.

5. The semiconductor wafer inspection apparatus according to claim 1 , wherein the conveyance arm includes a heat-resistant ceramic.

6. A semiconductor wafer inspection method in which a probe is brought into contact with a semiconductor device on a semiconductor wafer placed on a heated table and the semiconductor device is inspected for electric characteristics, comprising:
a preheating step of preheating the semiconductor wafer; and
a conveyance step of conveying the semiconductor wafer to a preheating position and conveying the semiconductor wafer which has been preheated in the preheating position to the table, wherein
in the preheating step, the semiconductor wafer is preheated while the semiconductor wafer is held by a conveyance arm which conveys the semiconductor wafer, a first portion of the conveyance arm is disposed within the preheating heater, and a second portion of the conveyance arm is disposed outside the preheating heater.

7. The semiconductor wafer inspection method according to claim 6 , wherein
the preheating step is a step of preheating the semiconductor wafer in a housing, wherein the semiconductor wafer is preheated in the preheating position in the housing in a state where the semiconductor wafer is held by the conveyance arm.

8. The semiconductor wafer inspection method according to claim 6 , wherein
in the preheating step, the semiconductor wafer is preheated in the preheating position separated from the table with heat propagated by convection or radiation from the table in a state where the semiconductor wafer is held by the conveyance arm.

9. The semiconductor wafer inspection method according to claim 6 , wherein
in the conveyance step, the conveyance arm rotates from a receiving position for conveying the semiconductor wafer.

10. The semiconductor wafer inspection method according to claim 6 , wherein the conveyance arm includes a heat-resistant ceramic.

Assignees

• Tokyo Seimitsu Co Ltd

Inventors

• Ishimoto Takashi
• Shigesawa Yuji
• Yamaguchi Akira
• Motoyama Takashi
• Takahashi Takenori

Classifications

• H10P72/7612

  characterised by lifting arrangements, e.g. lift pins · CPC title

• H10P72/0436

  mainly by radiation · CPC title

• H10P72/0434

  mainly by convection · CPC title

• H10P72/0432

  mainly by conduction · CPC title

• H10P72/70

  for supporting or gripping · CPC title