Substrate rinsing systems and methods

Patent metadata

Field	Value
Publication number	US-9859135-B2
Application number	US-201514626903-A
Country	US
Kind code	B2
Filing date	Feb 19, 2015
Priority date	Dec 19, 2014
Publication date	Jan 2, 2018
Grant date	Jan 2, 2018

Abstract

An example waterfall apparatus includes (1) a first portion of a first width having (a) a first plenum, a second plenum, and a restricted fluid path therebetween; (b) a first coupling surface; and (c) an inlet opening that creates a fluid path between the first coupling surface and the first plenum; and (2) a second portion of a second width larger than the first width and having (a) a second coupling surface; and (b) an inlet aligned with the first portion inlet opening. The first and second coupling surfaces form a slot that extends along at least a portion of a length of the waterfall apparatus and that connects to the second plenum. Fluid introduced into the second portion inlet fills the first plenum, travels through the restricted fluid path to the second plenum, and exits the slot between the first and second portions to form a rinsing fluid waterfall.

First claim

What is claimed is:

1. A waterfall apparatus configured to provide rinsing fluid to a substrate comprising:
a lower portion having:
a first width;
a first plenum, a second plenum separated from the first plenum and located above the first plenum, and a restricted fluid path extending between the first and second plenums; and
a first surface located on an upper side of the lower portion; and
an inlet opening that creates a fluid path between the first surface and the first plenum; and

an upper portion at least partially coupled to the lower portion having:
a second width that is larger than the first width; and
a second surface located on a lower side of the upper portion; and
an inlet that aligns with the inlet opening of the lower portion to create a fluid path to the first plenum through the upper portion;

wherein the first surface of the lower portion and the second surface of the upper portion form a slot that extends along at least a portion of a length of the waterfall apparatus and that connects to the second plenum; and
wherein fluid introduced into the inlet of the upper portion fills the first plenum of the lower portion, travels through the restricted fluid path to the second plenum, and exits the slot between the upper and lower portions to form a rinsing fluid waterfall.

2. The waterfall apparatus of claim 1 wherein the slot formed between the upper and lower portions has a length that is longer than a diameter of a substrate rinsed with the waterfall apparatus.

3. The waterfall apparatus of claim 2 wherein the slot has a length that is approximately 10 to 100 mm longer than a diameter of a substrate rinsed with the waterfall apparatus.

4. The waterfall apparatus of claim 3 wherein the slot has a length that is approximately 30 to 70 mm longer than a diameter of a substrate rinsed with the waterfall apparatus.

5. The waterfall apparatus of claim 2 wherein the slot is approximately 310 to 400 mm in length.

6. The waterfall apparatus of claim 5 wherein the slot is approximately 330 to 370 mm in length.

7. The waterfall apparatus of claim 1 wherein the slot has a height of approximately less than 0.5 mm.

8. The waterfall apparatus of claim 7 wherein the slot has a height of less than approximately 0.2 mm.

9. The waterfall apparatus of claim 1 wherein the first plenum includes a first side, a second side opposite the first side and a third side extending between the first side and the second side, wherein the first side is shorter than the second side and the third side extends between the first and second sides at an angle relative to the first surface of the lower portion.

10. The waterfall apparatus of claim 9 wherein the angle of the third side is between about 1 and 10 degrees relative to the first surface.

11. The waterfall apparatus of claim 10 wherein the angle of the third side is between about 3 and 6 degrees relative to the first surface.

12. The waterfall apparatus of claim 1 wherein at least one of the restricted flow path has a length equal to a length of the slot and the first and second plenums have a length equal to a length of the slot.

13. The waterfall apparatus of claim 1 wherein the second surface of the upper portion has a width that is larger than a width of the first surface of the lower portion so that fluid travelling through the slot formed between the first and second surfaces breaks contact with the first surface prior to the second surface.

14. The waterfall apparatus of claim 1 wherein the upper portion includes a flow deflector positioned at an end of the slot that redirects rinsing fluid flowing through the slot at an angle relative to the second surface of the upper portion.

15. The waterfall apparatus of claim 14 wherein the angle is approximately 40 to 60 degrees relative to the second surface.

Assignees

• Applied Materials Inc

Inventors

• Frankel Jonathan S
• Brown Brian J
• Francischetti Vincent S
• Mchugh Paul
• Hanson Kyle M
• Mikhaylichenko Ekaterina

Classifications

• H10P70/15

  by wet cleaning only (H10P70/52 takes precedence) · CPC title

• H10P72/0416

  with the semiconductor substrates being dipped in baths or vessels · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• B05B1/046

  Outlets formed, e.g. cut, in the circumference of tubular or spherical elements · CPC title

• H01L21/67057

  Electricity · mapped topic