Chip resistor and mounting structure thereof

Patent metadata

Field	Value
Publication number	US-9859041-B2
Application number	US-201715456879-A
Country	US
Kind code	B2
Filing date	Mar 13, 2017
Priority date	Jun 13, 2013
Publication date	Jan 2, 2018
Grant date	Jan 2, 2018

Abstract

A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

First claim

The invention claimed is:

1. A resistor comprising:
an insulating substrate including an obverse surface, a reverse surface, a first lateral face and a second lateral face, the obverse surface being spaced apart from the reverse surface in a thickness direction, the first lateral face being spaced apart from the second lateral face in a first direction perpendicular to the thickness direction;
a resistive element at least partially embedded in the substrate;
a first electrode extending from the first lateral face onto the reverse surface of the substrate, and overlapping with a part of the substrate and a part of the resistive member as viewed in the thickness direction; and
a second electrode extending from the second lateral face onto the reverse surface of the substrate, and overlapping with a part of the substrate and a part of the resistive member as viewed in the thickness direction,
wherein the resistive member includes a first end portion, a second end portion and a connecting portion, the first end portion being spaced apart from the second end portion in the first direction, the connecting portion being disposed between the first end portion and the second end portion,
the first end portion and the second end portion of the resistive member are connected to the first electrode and the second electrode, respectively,
the connecting portion of the resistive member includes a first joint part and a second joint part that are connected to the first end portion and the second end portion, respectively, the first joint part being offset from the second joint part as viewed in the first direction.

2. The resistor according to claim 1 , wherein the substrate comprises a resin portion and a glass fiber portion provided in the resin portion, and the resistive element is in direct contact with the glass fiber portion.

3. The resistor according to claim 2 , wherein the resin portion forms the obverse surface and the reverse surface of the substrate.

4. The resistor according to claim 1 , Wherein the resistive element includes a first lateral face and a second lateral face that are flush with the first lateral face of the substrate and the second lateral face of the substrate, respectively.

5. The resistor according to claim 1 , wherein the connecting portion of the resistive member has a serpentine shape.

6. The resistor according to claim 1 , wherein the first electrode includes a first conductive plate and a first plated layer formed on the first conductive plate.

7. The resistor according to claim 6 , further comprising a bonding layer disposed between the resistive element and the first conductive plate, wherein the bonding layer is in direct contact with the resistive element and the first conductive plate.

8. The resistor according to claim 6 , wherein the first conductive plate includes a bottom surface held in direct contact with the first plated layer.

9. The resistor according to claim 6 , wherein the first conductive plate includes a first end face and a second end face that are spaced apart from each other in a second direction perpendicular to the thickness direction and the first direction, and the first plated layer is in direct contact with the first end face and the second end face.

10. The resistor according to claim 6 , wherein the first conductive plate includes an outer lateral face and an inner lateral face that are spaced apart from each other in the first direction, and the first plated layer is in direct contact with the outer lateral face and the inner lateral face.

Assignees

• Rohm Co Ltd

Inventors

• Yoneda Masaki

Classifications

• H01C3/12

  lying in one plane · CPC title

• H05K3/3442

  having edge contacts, e.g. leadless chip capacitors, chip carriers · CPC title

• H01C1/028 Primary

  the resistive element being embedded in insulation with outer enclosing sheath · CPC title

• H01C1/142

  the terminals or tapping points being coated on the resistive element · CPC title

• H01C1/012 Primary

  the base extending along and imparting rigidity or reinforcement to the resistive element (H01C1/016 takes precedence; the resistive element being formed in two or more coils or loops as a spiral, helical or toroidal winding H01C3/18, H01C3/20; the resistive element being formed as one or more layers or coatings on a base H01C7/00) · CPC title