Resistance assembly for mobile device and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9801281-B2
Application number	US-201514686298-A
Country	US
Kind code	B2
Filing date	Apr 14, 2015
Priority date	May 19, 2014
Publication date	Oct 24, 2017
Grant date	Oct 24, 2017

Abstract

A resistance assembly for a mobile device and a manufacturing method thereof are disclosed. The resistance assembly for a mobile device in accordance with an aspect of the present invention includes: a substrate having a circuit formed thereon; first to fourth pads laminated and separated from one another on the substrate; first to fourth terminals connected to the first to fourth pads, respectively, by being formed in a longitudinal direction along edges of lateral surfaces of a resistance body that are opposite to each other; and first and second resistors formed in between the first to fourth terminals along the opposite lateral and connected in parallel to each other on the resistance body and configured to adjust electric current flowed into the circuit.

First claim

What is claimed is:

1. A resistance assembly for a mobile device, comprising:
a substrate having a circuit formed thereon;
first, second, third and fourth pads laminated and separated from one another on the substrate;
first, second, third and fourth terminals connected to the first, second, third and fourth pads, respectively, extending in a longitudinal direction along edges of lateral surfaces of a resistance body that are opposite to each other; and
a first resistor formed in between the first and second terminals, and a second resistor formed in between the third and fourth terminals and the first resistor and the second resistor are connected in parallel to each other and configured to adjust electric current flowed into the circuit,
wherein the first resistor is formed on a first lateral surface of the resistance body and the second resistor is formed on a second lateral surface of the resistance body,
the first and second lateral surfaces are orthogonal to the substrate,
a length of each of the first, second, third and fourth terminals in a length direction of the resistance body is greater than a width of each of the first, second, third and fourth terminals in a width direction of the resistance body, respectively,
wherein the resistance body is a rectangular, cuboid shape comprising a first side surface, a second side surface, a top surface and a bottom surface,
wherein the first and second side surfaces do not share a common edge and the top and bottom surfaces do not share a common edge,
wherein each of the first, second, third and fourth terminals are in contact with two corners of the resistance body,
wherein the first resistor is formed on the first side surface and portions of the top and bottom surfaces, and the second resistor is formed on the second side surface and different portions of the top and bottom surfaces,
wherein each of the first and second resistors is substantially rectangular-shaped,
wherein each of the first and second side surfaces comprises dividing grooves, and
wherein the first, second, third and fourth terminals extend into each of the respective dividing grooves.

2. The resistance assembly of claim 1 , wherein the first, second, third and fourth terminals are each extended along an edge of a surface of the resistance body that faces the substrate.

3. The resistance assembly of claim 2 , wherein the first and second resistors have a protective layer formed on surfaces thereof so as to protect portions of the first and second resistors that are exposed in between the first, second, third and fourth terminals.

4. The resistance assembly of claim 1 , wherein the first and second resistors have a protective layer formed on surfaces thereof so as to protect portions of the first and second resistors that are exposed in between the first, second, third and fourth terminals.

Assignees

• Samsung Electro Mech

Inventors

• Lee Jea-Hoon
• Choi Woo-Jin
• Kim Young-Key

Classifications

• H01C1/012 Primary

  the base extending along and imparting rigidity or reinforcement to the resistive element (H01C1/016 takes precedence; the resistive element being formed in two or more coils or loops as a spiral, helical or toroidal winding H01C3/18, H01C3/20; the resistive element being formed as one or more layers or coatings on a base H01C7/00) · CPC title

• H01C17/006

  adapted for manufacturing resistor chips · CPC title

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title

• H01C1/028

  the resistive element being embedded in insulation with outer enclosing sheath · CPC title

• H01C17/281

  by thick film techniques · CPC title