Surface mount resistor

Patent metadata

Field	Value
Publication number	US-10083780-B2
Application number	US-201715593795-A
Country	US
Kind code	B2
Filing date	May 12, 2017
Priority date	Mar 24, 2016
Publication date	Sep 25, 2018
Grant date	Sep 25, 2018

Abstract

Provided is a surface mount resistor that can be stably mounted without the need for lead wires to be to flattened. The surface mount resistor includes a first resistive element and a second resistive element arranged in parallel, the first resistive element having first lead wires at opposite ends thereof, and the second resistive element having second lead wires at opposite ends thereof. The first resistive element and the second resistive element are integrated by being covered with a sheath. The first lead wires and the second lead wires are arranged such that they protrude outward in a direction of an axis beyond the sheath. The first lead wires and the second lead wires are bent alongside surfaces and a bottom surface of the sheath.

First claim

What is claimed is:

1. A surface mount resistor comprising:
a first resistive element and a second resistive element arranged in parallel, the first resistive element having first lead wires at opposite ends thereof, and the second resistive element having second lead wires at opposite ends thereof,
wherein:
the first resistive element and the second resistive element are integrated by molding resin that covers the first resistive element and the second resistive element,
the first lead wires and the second lead wires are arranged such that the lead wires protrude outward in a direction of an axis beyond the molding resin, and
the first lead wires and the second lead wires are bent along side surfaces of the molding resin, and are further bent at positions away from a bottom surface of the molding resin in a downward direction so that each of the first resistive element and the second resistive element is connected to a surface of a mounting board via at least two lead wires led out from the opposite ends of each resistive element, that is, a total of four or more lead wires, at positions below the bottom surface of the molding resin.

2. The surface mount resistor according to claim 1 , further comprising a lead wire housing portion on the bottom surface of the sheath, the lead wire housing portion being adapted to house the first lead wires and the second lead wires therein.

3. The surface mount resistor according to claim 2 , wherein:
the lead wire housing portion has a sloped portion that is sloped from an end surface toward a center of the sheath, and
the first lead wires and the second lead wires are bent along the sloped portion.

4. The surface mount resistor according to claim 2 , wherein the first lead wires and the second lead wires are housed in the lead wire housing portion, and are connected at points to the mounting board.

5. The surface mount resistor according to claim 1 , wherein the first and second resistive elements are wire-wound resistive elements having opposite winding directions.

6. The surface mount resistor according to claim 1 , wherein the first and second resistive elements are a wire-wound resistive element and a film resistive element.

7. The surface mount resistor according to claim 1 , wherein connection lands are arranged on the mounting board so that the first and second resistive elements are connected in series or parallel on the connection lands.

8. The surface mount resistor according to claim 1 , wherein the sheath is a molded thermosetting insulating material.

Assignees

• Koa Corp

Inventors

• Naito Takashi

Classifications

• H01C7/003

  Thick film resistors · CPC title

• H01C3/14

  the resistive element being formed in two or more coils or loops continuously wound as a spiral, helical or toroidal winding (H01C3/02 - H01C3/12 take precedence) · CPC title

• H01C1/14 Primary

  Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors · CPC title

• H01C1/028 Primary

  the resistive element being embedded in insulation with outer enclosing sheath · CPC title

• H01C1/02 Primary

  Housing; Enclosing; Embedding; Filling the housing or enclosure · CPC title