Optical component

Patent metadata

Field	Value
Publication number	US-9851555-B2
Application number	US-201615050664-A
Country	US
Kind code	B2
Filing date	Feb 23, 2016
Priority date	Aug 28, 2013
Publication date	Dec 26, 2017
Grant date	Dec 26, 2017

Abstract

An optical component includes at least one micro-opto-electro-mechanical system (MOEMS) with a front side and a rear side. The optical component also includes at least one printed circuit board arranged on the rear side of the at least one MOEMS. The at least one printed circuit board has lateral contacts. The at least one printed circuit board may be equipped with electronic parts and cooling elements. The at least one MOEMS projects laterally beyond the at least one printed circuit board.

First claim

What is claimed is:

1. An optical component, comprising:
a micro-opto-electro-mechanical system (MOEMS) having a front side and a rear side;
a printed circuit board supported by the rear side of the MOEMS; and
a cover,
wherein:
the MOEMS, the printed circuit board and the cover delimit a cavity;
the MOEMS delimits a first side of the cavity;
the cover delimits a second side of the cavity in a vacuum-tight manner;
the first side of the cavity is opposite the second side of the cavity; and
the printed circuit board delimits a third side of the cavity which is between the first and second sides of the cavity.

2. The optical component of claim 1 , wherein the printed circuit board comprises a multi-layer printed circuit board.

3. The optical component of claim 1 , wherein the cavity is directly adjacent to the rear side of the MOEMS.

4. The optical component of claim 1 , further comprising at least one member in the cavity, wherein the at least one member is selected from the group consisting of an electrical part and a cooling element.

5. The optical component of claim 1 , further comprising a filler material in the cavity.

6. The optical component of claim 1 , wherein the printed circuit board comprises lateral contacts.

7. The optical component of claim 6 , wherein the lateral contacts comprise vertical interconnect accesses.

8. The optical component of claim 6 , wherein the lateral contacts comprise self-centering lateral contacts.

9. The optical component of claim 6 , wherein the printed circuit board comprises spring-loaded elements that electrically contact the lateral contacts.

10. The optical component of claim 1 , further comprising contacts that electrically connect the printed circuit board and the MOEMS.

11. The optical component of claim 10 , wherein the contacts comprise at least one member selected from the group consisting of wire-bond contacts, flip chip contacts and bond contacts.

12. A facet mirror, comprising:
an optical component according to claim 1 ,
wherein the facet mirror is a microlithography facet mirror.

13. The facet mirror of claim 12 , wherein the facet mirror is a multi-mirror array.

14. An illumination optical unit, comprising:
an optical component according to claim 1 ,
wherein the illumination optical unit is a microlithography illumination optical unit.

15. An illumination system, comprising:
a radiation source; and
an illumination optical unit comprising an optical component according to claim 1 ,
wherein the illumination system is a microlithography illumination system.

16. A projection exposure apparatus, comprising:
an illumination optical unit an optical component according to claim 1 , the illumination optical unit configured to illuminate an object field; and
a projection optical unit configured to project the object field into an image field,
wherein the projection exposure apparatus is a microlithography projection exposure apparatus.

17. A method of operating a microlithography projection exposure apparatus comprising an illumination optical unit and a projection optical unit, the illumination optical unit comprising an optical component, the method comprising:
using the illumination optical unit to illuminate an object field; and
using the projection optical unit to project the object field into an image field,
wherein the optical component comprises an optical component according to claim 1 .

18. The optical component of claim 1 , wherein the MOEMS projects laterally beyond the printed circuit board.

19. The optical component of claim 1 , wherein a cross-section of the printed circuit board is less than an overall reflection area of the optical component.

20. An optical component, comprising:
a micro-opto-electro-mechanical system (MOEMS) having a front side and a rear side;
a printed circuit board supported by the rear side of the MOEMS; and
a cover,
wherein:
the printed circuit board, the MOEMS and the cover delimit a vacuum-tight cavity;
the MOEMS delimits a first side of the cavity;
the cover delimits a second side of the cavity which is opposite the first side of the cavity;
the printed circuit board delimits a third side of the cavity which is between the first and second sides of the cavity.

Assignees

• Zeiss Carl Smt Gmbh

Inventors

• Holz Markus
• Sigel Benjamin
• Horn Jan
• Knauf Benedikt
• Haacker Fabian

Classifications

• H10W72/932

  Plan-view shape, i.e. in top view · CPC title

• H01L2924/00014

  Electricity · mapped topic

• G02B26/0833 Primary

  the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD (G02B26/0825 takes precedence; micromechanical devices in general B81B) · CPC title

• G03F7/2002

  with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image · CPC title

• B81B7/007 Primary

  Interconnections between the MEMS and external electrical signals · CPC title