Capacitor assembly and related method of forming

Patent metadata

Field	Value
Publication number	US-9847174-B2
Application number	US-201514964120-A
Country	US
Kind code	B2
Filing date	Dec 9, 2015
Priority date	Dec 9, 2015
Publication date	Dec 19, 2017
Grant date	Dec 19, 2017

Abstract

A capacitor assembly is disclosed. The capacitor assembly includes a housing. The capacitor assembly further includes a plurality of capacitors disposed within the housing. Furthermore, the capacitor assembly includes a thermally conductive article disposed about at least a portion of a capacitor body of the capacitors, and in thermal contact with the capacitor body. Moreover, the capacitor assembly also includes a heat sink disposed within the housing and in thermal contact with at least a portion of the housing and the thermally conductive article such that the heat sink is configured to remove heat from the capacitor in a radial direction of the capacitor assembly. Further, a method of forming the capacitor assembly is also presented.

First claim

The invention claimed is:

1. A capacitor assembly, comprising:
a housing;
a plurality of capacitors disposed within the housing;
a thermally conductive article disposed about at least a portion of a capacitor body of the plurality of capacitors, and in thermal contact with the capacitor body; and
a heat sink disposed within the housing and in thermal contact with at least a portion of the housing and the thermally conductive article, wherein the thermally conductive article is configured to transfer heat from the capacitor body to the heat sink in a radial direction of the capacitor assembly and the heat sink is configured to transfer heat from the thermally conductive article to the housing in the radial direction of the capacitor assembly.

2. The capacitor assembly of claim 1 , further comprising a plurality of electrical conductors disposed in the housing, wherein the plurality of capacitors is electrically coupled to the plurality of electrical conductors, and wherein the heat sink is thermally coupled to the plurality of electrical conductors such that the heat sink is further configured to remove heat from the plurality of capacitors in an axial direction of the capacitor assembly.

3. The capacitor assembly of claim 2 , wherein each capacitor of the plurality of capacitors comprises a plurality of electrodes electrically coupled to the plurality of electrical conductors.

4. The capacitor assembly of claim 1 , wherein the thermally conductive article comprises a foil.

5. The capacitor assembly of claim 4 , wherein the thermally conductive article further comprises a heat pipe.

6. The capacitor assembly of claim 1 , wherein the heat sink comprises a coating comprising a dielectric material.

7. The capacitor assembly of claim 1 , further comprising a thermally conductive shim disposed in thermal contact between the thermally conductive article and the heat sink.

8. The capacitor assembly of claim 1 , wherein the heat sink comprises a phase change material.

9. The capacitor assembly of claim 1 , wherein the heat sink is disposed on a side wall of the housing.

10. The capacitor assembly of claim 9 , wherein the side wall is perpendicular to the radial direction of the of the capacitor assembly.

11. The capacitor assembly of claim 7 , wherein the thermally conductive shim comprises AlN, BN, Al2O3, TiO2, titania coated aluminum metal sheet, MgO, or diamond-like carbon coating (DLC).

12. The capacitor assembly of claim 7 , wherein a thickness of the thermally conductive shim is in a range of 1 to 200 microns.

13. The capacitor assembly of claim 7 , further comprising a coating of zirconium oxide, titanium oxide coated aluminum metal sheet, DLC, or combinations thereof, disposed on the thermally conductive shim.

14. The capacitor assembly of claim 6 , wherein a thickness of the coating is in a range of 5 to 100 microns and the dielectric material comprises titanium oxide.

15. A capacitor assembly, comprising:
a housing;
a plurality of capacitors disposed within the housing;
a thermally conductive article disposed about at least a portion of a capacitor body of the plurality of capacitors, and in thermal contact with the capacitor body;
a plurality of electrical conductors disposed in the housing, wherein the plurality of capacitors is electrically coupled to the plurality of electrical conductors via a plurality of electrodes; and
a heat sink disposed within the housing and in thermal contact with at least a portion of the housing, the thermally conductive article, and the plurality of electrical conductors, wherein the thermally conductive article is configured to transfer heat from the capacitor body to the heat sink in a radial direction of the capacitor assembly, and wherein the heat sink is configured to transfer heat from the thermally conductive article to the housing in the radial direction of the capacitor assembly and transfer heat from the plurality of electrical conductors to the housing in an axial direction of the capacitor assembly.

16. The capacitor assembly of claim 15 , wherein the thermally conductive article comprises a foil.

17. The capacitor assembly of claim 16 , wherein the thermally conductive article further comprises a heat pipe.

18. The capacitor assembly of claim 15 , wherein the heat sink comprises a coating comprising a dielectric material.

19. The capacitor assembly of claim 15 , further comprising a thermally conductive shim disposed in thermal contact between the thermally conductive article and the heat sink.

20. The capacitor assembly of claim 15 , wherein the heat sink comprises a phase change material.

21. A method for forming a capacitor assembly, comprising: disposing a plurality of capacitors, a thermally conductive article, and a heat sink within a housing such that the thermally conductive article is disposed about at least a portion of a capacitor body of the plurality of capacitors and in thermal contact with the capacitor body, and the heat sink is disposed in thermal contact with at least a portion of the housing and the thermally conductive article such that the thermally conductive article is configured to transfer heat from the capacitor body to the heat sink in a radial direction of the capacitor assembly and the heat sink is configured to transfer heat from the thermally conductive article to the housing in the radial direction of the capacitor assembly.

22. The method of claim 21 , wherein each capacitor of the plurality of capacitors comprises a plurality of electrodes, and wherein the method further comprises disposing a plurality of electrical conductors in the housing such that the plurality of electrical conductors is in electrical contact with the plurality of electrodes and in thermal contact with the heat sink.

23. The method of claim 22 , further comprising disposing a thermally conductive shim between the plurality of electrical conductors and the heat sink.

Assignees

• Gen Electric

Inventors

• Zhang Lili
• Tan Daniel Qi
• Sullivan Jeffrey S

Classifications

• H01G4/258 Primary

  Temperature compensation means · CPC title

• H01G4/38

  Multiple capacitors, i.e. structural combinations of fixed capacitors · CPC title

• H01G4/224

  Housing; Encapsulation · CPC title

• H01G2/08

  Cooling arrangements; Heating arrangements; Ventilating arrangements · CPC title

• H01G4/32

  Wound capacitors · CPC title