Film capacitor and the method of forming the same

Patent metadata

Field	Value
Publication number	US-10128044-B2
Application number	US-201514943433-A
Country	US
Kind code	B2
Filing date	Nov 17, 2015
Priority date	Nov 17, 2015
Publication date	Nov 13, 2018
Grant date	Nov 13, 2018

Abstract

A film capacitor is presented. The film capacitor includes a thermally conductive support. The thermally conductive support includes a core including a first end and a second end. The thermally conductive support further includes a protrusion extending from at least one of the first end and the second end of the core, where at least one of the core and the protrusion includes a phase change material. Further, the film capacitor also includes a plurality of films disposed on at least a portion of the thermally conductive support, where the plurality of films includes a plurality of electrode films and a dielectric film. Further, the thermally conductive support for the film capacitor and a method of forming the film capacitor are also presented.

First claim

The invention claimed is:

1. A film capacitor, comprising:
a thermally conductive support comprising:
a core comprising a first end and a second end, and
a protrusion extending from at least one of the first end and the second end of the core, wherein at least one of the core and the protrusion comprises a phase change material; and

a plurality of films disposed on at least a portion of the thermally conductive support, wherein the plurality of films comprises a plurality of electrode films and a dielectric film.

2. The film capacitor of claim 1 , wherein the core is characterized by a first axis and the protrusion is characterized by a second axis, and an angle between the first axis and the second axis is in a range from about 80 to 110 degrees.

3. The film capacitor of claim 2 , wherein the angle between the first axis and the second axis is substantially 90 degrees.

4. The film capacitor of claim 1 , wherein the protrusion comprises a disc or a ring, which is substantially concentric with the core.

5. The film capacitor of claim 1 , wherein at least one of the core and the protrusion is solid.

6. The film capacitor of claim 1 , wherein at least one of the core and the protrusion is hollow.

7. The film capacitor of claim 1 , wherein at least one of the core and the protrusion comprises aluminum, copper, iron, boron nitride, aluminum nitride, silicon nitride, silicon carbide, oxide ceramic, or combinations thereof.

8. The film capacitor of claim 1 , wherein the film capacitor is a wound film capacitor.

9. The film capacitor of claim 1 , wherein the core comprises one or more walls, and wherein at least one wall of the one or more walls is hollow and comprises the phase change material.

10. The film capacitor of claim 1 , further comprising a hollow base core interposed between the plurality of films and the thermally conductive support, wherein the plurality of films is disposed on at least a portion of the hollow base core and the thermally conductive support is disposed within at least a portion of the hollow base core.

11. The film capacitor of claim 1 , further comprising a heat pipe, wherein at least a portion of the heat pipe is disposed in thermal contact with at least a portion of the thermally conductive support.

12. A thermally conductive support for a film capacitor, comprising:
a core comprising a first end and a second end; and
a protrusion extending from at least one of the first end and the second end of the core, wherein at least one of the core and the protrusion comprises a phase change material.

13. The thermally conductive support of claim 12 , wherein the core is characterized by a first axis and the protrusion is characterized by a second axis, and an angle between the first axis and the second axis is in a range from about 80 to 110 degrees.

14. The thermally conductive support of claim 12 , wherein the protrusion comprises a disc or a ring, which is substantially concentric with the core.

15. The thermally conductive support of claim 12 , wherein the core comprises one or more walls, and wherein at least one wall of the one or more walls is hollow and comprises the phase change material.

16. A method, comprising:
forming a film capacitor, wherein the film capacitor comprises:
a thermally conductive support comprising:
a core comprising a first end and a second end, and
a protrusion extending from at least one of the first end and the second end of the core, and wherein at least one of the core and the protrusion comprises a phase change material; and

a plurality of films disposed on at least a portion of the thermally conductive support, wherein the plurality of films comprises a plurality of electrode films and a dielectric film.

17. The method of claim 16 , wherein the step of forming a film capacitor comprises:
providing the thermally conductive support; and
disposing the plurality of films on at least a portion of the thermally conductive support.

18. The method of claim 16 , wherein the step of forming a film capacitor comprises:
disposing the plurality of films on at least a portion of a hollow base core; and
inserting the thermally conductive support into at least a portion of the hollow base core.

19. The method of claim 16 , further comprising forming the thermally conductive support comprising at least one of a hollow core and a hollow protrusion.

20. The method of claim 19 , wherein forming the thermally conductive support further comprises disposing the phase change material within a portion of at least one of the hollow core and the hollow protrusion.

Assignees

• Gen Electric

Inventors

• Tan Daniel Qi
• Zhang Lili
• Smolenski Joseph Lucian
• Sullivan Jeffrey S

Classifications

• H01G4/28

  Tubular capacitors · CPC title

• H01G4/33

  Thin- or thick-film capacitors {(thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)} · CPC title

• H01G2/08

  Cooling arrangements; Heating arrangements; Ventilating arrangements · CPC title

• H01G4/258

  Temperature compensation means · CPC title

• H01G4/32

  Wound capacitors · CPC title