Multilayer ceramic capacitor structures for use at high power

Patent metadata

Field	Value
Publication number	US-10147544-B1
Application number	US-201715601323-A
Country	US
Kind code	B1
Filing date	May 22, 2017
Priority date	May 22, 2017
Publication date	Dec 4, 2018
Grant date	Dec 4, 2018

Abstract

An improved multilayered ceramic capacitor is provided wherein the capacitor has improved heat dissipation properties. The capacitor comprises first internal electrodes and second internal electrodes wherein the first internal electrodes are parallel with, and of opposite polarity, to the second internal electrodes. Dielectric layers are between the first internal electrodes and second internal electrodes and a thermal dissipation channel is in at least one dielectric layer. A thermal transfer medium is in the thermal dissipation channel.

First claim

The invention claimed is:

1. A multilayered ceramic capacitor comprising:
first internal electrodes and second internal electrodes wherein said first internal electrodes are parallel with, and of opposite polarity, to said second internal electrodes;
sintered ceramic dielectric layers between said first internal electrodes and said second internal electrodes wherein said first internal electrodes and said second internal electrodes are embedded in said sintered ceramic dielectric layers;
a thermal dissipation channel in at least one dielectric layer of said sintered ceramic dielectric layers; and
a flowing thermal transfer medium in said thermal dissipation channel.

2. The multilayered ceramic capacitor of claim 1 wherein said first internal electrodes and said second internal electrodes are interleaved.

3. The multilayered ceramic capacitor of claim 1 wherein a first internal electrode of said first internal electrodes and a second internal electrode of said second internal electrodes are in a first common plane and a second first internal electrode of said first internal electrodes and a second second internal electrode of said second internal electrodes are in a second common plane.

4. The multilayered ceramic capacitor of claim 3 further comprising a floating electrode between said first common plane and said second common plane.

5. The multilayered ceramic capacitor of claim 3 wherein said thermal dissipation channel is between said first common plane and said second common plane.

6. The multilayered ceramic capacitor of claim 3 wherein said thermal dissipation channel is in at least one of said first common plane or said second common plane.

7. The multilayered ceramic capacitor of claim 1 comprising multiple thermal dissipation channels.

8. The multilayered ceramic capacitor of claim 7 wherein further comprising a barrier between adjacent thermal dissipation channels of said multiple thermal dissipation channels.

9. The multilayered ceramic capacitor of claim 7 wherein multiple thermal dissipation channels are in a common plane of dissipation channels.

10. The multilayered ceramic capacitor of claim 1 wherein at least one of said first internal electrodes or said second internal electrodes comprise a material selected from the group consisting of nickel, copper, a precious metal and alloys thereof.

11. An array comprising multiple multilayered ceramic capacitors of claim 1 .

12. An electronic device comprising at least one multilayered ceramic capacitor of claim 1 .

13. The electronic device of claim 12 comprising an array of said multilayered ceramic capacitors.

14. The electronic device of claim 12 further comprising a heat transfer device capable of assisting with at least one of circulation or cooling of said thermal transfer medium.

15. The electronic device of claim 12 wherein said thermal transfer medium is in a closed loop.

16. The electronic device of claim 12 wherein said thermal transfer medium is in an open loop.

17. The electronic device of claim 12 wherein said thermal transfer medium flows through said thermal dissipation channel.

18. A multilayered ceramic capacitor comprising:
first internal electrodes and second internal electrodes wherein said first internal electrodes are parallel with, and of opposite polarity, to said second internal electrodes;
sintered ceramic dielectric layers between said first internal electrodes and said second internal electrodes wherein said first internal electrodes and said second internal electrodes are embedded in said sintered ceramic dielectric layers;
a thermal dissipation channel in at least one dielectric layer of said sintered ceramic dielectric layers; and
a thermal transfer medium in said thermal dissipation channel wherein said thermal dissipation channel is between a first internal electrode of said first internal electrodes and a second internal electrode of said second internal electrodes.

19. The multilayered ceramic capacitor of claim 18 wherein said thermal dissipation channel is in flow contact at least one of said first internal electrode or said second internal electrode.

20. The multilayered ceramic capacitor of claim 18 wherein said thermal dissipation channel is not in flow contact at least one of said first internal electrode or said second internal electrode.

21. A multilayered ceramic capacitor comprising:
first internal electrodes and second internal electrodes wherein said first internal electrodes are parallel with, and of opposite polarity, to said second internal electrodes;
sintered ceramic dielectric layers between said first internal electrodes and said second internal electrodes wherein said first internal electrodes and said second internal electrodes are embedded in said sintered ceramic dielectric layers;
a flowing thermal dissipation channel in at least one dielectric layer of said sintered ceramic dielectric layers; and
a thermal transfer medium in said thermal dissipation channel further comprising shield electrodes.

22. The multilayered ceramic capacitor of claim 21 wherein said thermal dissipation channel is coplanar with said shield electrodes.

23. A multilayered ceramic capacitor comprising:
first internal electrodes and second internal electrodes wherein said first internal electrodes are parallel with, and of opposite polarity, to said second internal electrodes;
sintered ceramic dielectric layers between said first internal electrodes and said second internal electrodes wherein said first internal electrodes and said second internal electrodes are embedded in said sintered ceramic dielectric layers;
a thermal dissipation channel in at least one dielectric layer of said sintered ceramic dielectric layers; and
a thermal transfer medium in said thermal dissipation channel wherein said common plane of dissipation channels is parallel to a first internal electrode of said internal electrodes.

24. A multilayered ceramic capacitor comprising:
first internal electrodes and second internal electrodes wherein said first internal electrodes are parallel with, and of opposite polarity, to said second internal electrodes;
dielectric layers between said first internal electrodes and said second internal electrodes;
a thermal dissipation channel in at least one dielectric layer of said dielectric layers;
a thermal transfer medium in said thermal dissipation channel; and further comprising at least one strut in said thermal dissipation channel.

25. A multilayered ceramic capacitor comprising:
first internal electrodes and second internal electrodes wherein said first internal electrodes are parallel with, and of opposite polarity, to said second internal electrodes;
dielectric layers between said first internal electrodes and said second internal electrodes;
a thermal dissipation channel in at least one dielectric layer of said dielectric layers;
a thermal transfer medium in said thermal dissipation channel; and further comprising a coating in said thermal dissipation channel.

Assignees

• Kemet Electronics Corp

Inventors

• Bultitude John
• Lessner Philip M
• Gurav Abhijit

Classifications

• H01G4/38

  Multiple capacitors, i.e. structural combinations of fixed capacitors · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G4/258 Primary

  Temperature compensation means · CPC title