Packaging methods and packaged semiconductor devices

Patent metadata

Field	Value
Publication number	US-9263412-B2
Application number	US-201414473435-A
Country	US
Kind code	B2
Filing date	Aug 29, 2014
Priority date	Mar 9, 2012
Publication date	Feb 16, 2016
Grant date	Feb 16, 2016

Abstract

An embodiment is a method including forming a first package and a second package. The first package includes packaging a first die, forming a plurality of solder balls on the first die, and coating the plurality of solder balls with an epoxy flux. The second package includes forming a first electrical connector, attaching a second die adjacent the first electrical connector, forming a interconnect structure over the first die and the first electrical connector, the interconnect structure being a frontside of the second package, forming a second electrical connector over the interconnect structure, and the second electrical connector being coupled to both the first die and the first electrical connector. The method further includes bonding the first package to the backside of the second package with the plurality of solder balls forming a plurality of solder joints, each of the plurality of solder joints being surrounded by the epoxy flux.

First claim

What is claimed is:

1. A method comprising:
forming a first package comprising:
partially packaging a first die;
forming a plurality of solder balls on a surface of the partially packaged first die; and
coating the plurality of solder balls with an epoxy flux;

forming a second package comprising:
forming a first electrical connector over a carrier wafer;
attaching a second die adjacent the first electrical connector and over the carrier wafer;
forming an interconnect structure over the second die and the first electrical connector, the interconnect structure being a frontside of the second package;
forming a second electrical connector over the interconnect structure, the second electrical connector being coupled to both the second die and the first electrical connector; and
removing the carrier wafer to expose a backside of the second package, the backside being opposite the frontside; and

bonding the first package to the backside of the second package with the plurality of solder balls forming a plurality of solder joints, each of the plurality of solder joints being surrounded by the epoxy flux.

2. The method of claim 1 , wherein the epoxy flux has a greater thickness adjacent the plurality of solder joints proximate the first package and the second package than proximate a central region of the plurality of solder joints.

3. The method of claim 1 , wherein the coating the plurality of solder balls with the epoxy flux comprises an epoxy flux that includes a filler material.

4. The method of claim 1 , wherein the coating the plurality of solder balls with the epoxy flux comprises jet-spraying the epoxy flux on the plurality of solder balls after the forming the plurality of solder balls on the surface of the partially packaged first die.

5. The method of claim 1 , wherein the forming the first package further comprises:
coining the plurality of solder balls forming exposed flat surfaces on each of the plurality of solder balls.

6. The method of claim 1 , wherein the forming the second package further comprises encapsulating the second die and the first electrical connector with a molding material, the first electrical connector extending through the molding material from the backside to the frontside of the second package, and wherein the second electrical connector is a metal bump.

7. The method of claim 1 , wherein the forming the second package further comprises:
screen printing an epoxy solder paste over the backside of the second package to form a plurality of epoxy solder paste structures, a first one of the plurality of epoxy solder paste structures directly contacting a surface of the first electrical connector.

8. The method of claim 7 , wherein the bonding the first package to the backside of the second package further comprises bonding the plurality of solder balls to the plurality of epoxy solder paste structures forming the plurality of solder joints.

9. The method of claim 8 , wherein sidewalls of the plurality of solder joints are substantially perpendicular to the backside of the second package.

10. The method of claim 7 , wherein the epoxy solder paste comprises tin, bismuth, and an epoxy component.

11. The method of claim 1 , further comprising forming an underfill material disposed between the first package, the second package, and the epoxy flux surrounding the plurality of solder joints, the underfill material having a different material composition than the epoxy flux.

12. A method comprising:
packaging a first die to form a first package;
forming a plurality of solder balls on a surface of the first package;
forming an epoxy flux on the plurality of solder balls;
packaging a second die to form a second package, the packaging the second die comprising forming a first through package via (TPV) extending through the second package, the first TPV being laterally spaced from the second die, the first TPV having a first surface substantially coplanar with a backside surface of the second die and a second surface substantially coplanar with an active surface of the second die; and
coupling the plurality of solder balls to the second package forming a plurality of solder joints surrounded by epoxy flux, at least one of the solder joints being coupled to the first surface of the first TPV;
wherein each of the plurality of solder joints comprises a metal stud, and a portion of the metal stud directly adjoins the epoxy flux.

13. The method of claim 12 , wherein the packaging the second die to form the second package further comprises:
screen printing an epoxy solder paste over the backside surface of the second die and the first surface of the first TPV to form a plurality of epoxy solder paste structures, a first one of the plurality of epoxy solder paste structures directly contacting the first surface of the first TPV.

14. The method of claim 13 , wherein the plurality of solder balls have a first reflow temperature and the plurality of epoxy solder paste structures have a second reflow temperature, the second reflow temperature being less than the first reflow temperature, wherein the coupling the plurality of solder balls to the second package comprises reflowing a solder material of the plurality of epoxy solder paste structures at a temperature less than the first reflow temperature.

15. The method of claim 14 , wherein the coupling the plurality of solder balls to the second package does not include reflowing a solder material of the plurality of solder balls.

16. The method of claim 12 further comprising an underfill surrounding the epoxy flux on the plurality of solder joints, the underfill having a different material composition than the epoxy flux.

17. A method comprising:
packaging a first die to form a first package;
forming a plurality of solder balls on a surface of the first package;
coating the plurality of solder balls with an epoxy flux;
packaging a second die to form a second package, the packaging the second die comprising:
forming a first through package via (TPV) extending through an encapsulant of the second package, a first surface of the first TPV being substantially coplanar with a backside surface of the second die and a second surface of the first TPV being substantially coplanar with an active surface of the second die; and
screen printing an epoxy solder paste over the backside surface of the second die and the first surface of the first TPV to form a plurality of epoxy solder paste structures, a first one of the plurality of epoxy solder paste structures directly contacting the first surface of the first TPV; and

coupling the plurality of solder balls to the second package forming a plurality of solder joints surrounded by epoxy flux, at least one of the solder joints being coupled to the first surface of the first TPV.

18. The method of claim 17 , wherein the plurality of solder balls have a first reflow temperature and the plurality of epoxy solder paste structures have a second reflow temperature, the second reflow temperature being less than the first reflow temperature, wherein the coupling the plurality of solder balls to the second package comprises reflowing a solder material of the plurality of epoxy solder paste structures at a temperature less than the first reflow temperature.

19. The method of claim 12 , wherein the first TPV extends through an encapsulant of the second package.

Assignees

• Taiwan Semiconductor Mfg

Inventors

• Lin Wei-Hung
• Cheng Ming-Da
• Liu Chung-Shi
• Chen Wei-Yu
• Lin Hsiu-Jen
• Huang Kuei-Wei

Classifications

• B23K35/3612

  with organic compounds as principal constituents · CPC title

• B23K35/24

  Selection of soldering or welding materials proper (B23K35/34 takes precedence) · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W90/722

  between stacked chips · CPC title