3-dimensional printing process for integrated magnetics

Patent metadata

Field	Value
Publication number	US-10446639-B2
Application number	US-201715473564-A
Country	US
Kind code	B2
Filing date	Mar 29, 2017
Priority date	Mar 29, 2017
Publication date	Oct 15, 2019
Grant date	Oct 15, 2019

Abstract

Integrated circuits (ICs) and method for forming IC devices are presented. In one embodiment, a method of forming a device with an integrated magnetic component using 3-dimensional (3-D) printing is disclosed. The method includes providing a substrate with a base dielectric layer, the base dielectric layer serves as a base for the integrated magnetic component. A first metal layer is formed on the substrate by spray coating metal powder over the substrate and performing selective laser melting on the metal powder. A magnetic core is formed on the substrate by spray coating magnet powder over the substrate and performing selective laser sintering on the magnet powder. A second metal layer is formed on the substrate by spray coating metal powder over the substrate and performing selective laser melting on the metal powder. A patterned dielectric layer separates the first and second metal layers and the magnetic core.

First claim

What is claimed is:

1. A method of forming a device with an integrated magnetic component using three-dimensional printing, comprising:
providing a substrate with a first dielectric layer;
forming a first layer of a magnetic core on the first dielectric layer by spray coating a magnetic powder over the first dielectric layer and selective laser sintering the magnetic powder;
forming a second dielectric layer over the first layer of the magnetic core;
patterning the second dielectric layer to include a first plurality of openings extending to the first layer of the magnetic core;
forming a metal winding on the second dielectric layer by spray coating a metal powder over the second dielectric layer and selective laser sintering the metal powder;
forming a third dielectric layer over the metal winding and the second dielectric layer;
patterning the third dielectric layer to include a second plurality of openings connected with the first plurality of openings; and
forming a second layer of the magnetic core on the third dielectric layer by spray coating a magnetic powder over the substrate and selective laser sintering the magnetic powder,
wherein the second dielectric layer and the third dielectric layer insulate the first and second layers of the magnetic core and the metal winding, and the spray coating of the magnetic powder of the second layer of the magnetic core fills the first plurality of openings and the second plurality of openings such that, after selective layer sintering, the first and second layers of the magnetic core are interconnected and surround the metal winding.

2. The method of claim 1 wherein the second dielectric layer is formed over the first layer of the magnetic core by spray coating a dielectric polymer powder over the first layer of the magnetic core and performing selective laser exposure and curing on the dielectric polymer powder.

3. The method of claim 2 wherein the second dielectric layer comprises polyimide.

4. The method of claim 2 wherein the third dielectric layer is formed over the metal winding and the second dielectric layer by spray coating a dielectric polymer powder over the metal winding and the second dielectric layer and performing selective laser exposure and curing on the dielectric polymer powder.

5. The method of claim 4 wherein the thickness of the dielectric polymer powder is about 10 μm for forming the second dielectric layer and the third dielectric layer.

6. The method of claim 5 wherein the second dielectric layer and the third dielectric layer each comprise polyimide.

7. The method of claim 1 wherein the magnetic powder and the metal powder are spray coated in a sealed chamber with a vacuum or inert environment.

8. The method of claim 1 wherein selective laser sintering the metal powder of the metal winding comprises:
scanning a high powered laser beam to selectively scan and fuse the metal powder until a fully dense metal layer is formed.

9. The method of claim 1 wherein the device has a planar spiral shape.

10. The method of claim 1 wherein the metal powder and the magnetic powder which are spray coated comprise gas atomized powders.

11. The method of claim 1 wherein the thickness of the metal powder for forming the metal winding is about 20 μm.

12. The method of claim 1 wherein the thickness of the magnetic powder for forming the first layer of the magnetic core and the second layer of the magnetic core is about 10 μm.

Assignees

• Globalfoundries Sg Pte Ltd

Inventors

• Peng Lulu
• Disney Donald Ray
• Susai Lawrence Selvaraj
• Nair Rajesh Sankaranarayanan

Classifications

• H10P14/412

  Deposition of metallic or metal-silicide materials · CPC title

• H10W20/497

  Inductive arrangements or effects of, or between, wiring layers · CPC title

• B22F10/32

  of the atmosphere, e.g. composition or pressure in a building chamber · CPC title

• B22F10/28

  Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

• B29L2031/34

  Electrical apparatus, e.g. sparking plugs or parts thereof · CPC title