Electronic substrates having embedded inductors
US-2024331921-A1 · Oct 3, 2024 · US
Details of via holes for interconnecting the layers
Details of via holes for interconnecting the layers · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01F2017/002 |
| Official title | {Details of via holes for interconnecting the layers} |
| Display label | Details of via holes for interconnecting the layers |
| Total patents | 890 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 27 |
| 2016 | 43 |
| 2017 | 44 |
| 2018 | 58 |
| 2019 | 98 |
| 2020 | 112 |
| 2021 | 82 |
| 2022 | 123 |
| 2023 | 99 |
| 2024 | 104 |
| 2025 | 85 |
| 2026 | 15 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Inductor device, inductor array, and multilayered substrate, and method for manufacturing inductor device
US-2016372246-A1 · Dec 22, 2016 · US
Wiring board and method for manufacturing wiring board
US-9520222-B2 · Dec 13, 2016 · US
Inductor
US-2016351321-A1 · Dec 1, 2016 · US
Integrated device package comprising an electromagnetic (em) passive device in an encapsulation layer, and an em shield
US-2016322300-A1 · Nov 3, 2016 · US
Electronic component and method for manufacturing the same
US-2016314891-A1 · Oct 27, 2016 · US
Vertical spiral inductor
US-9478348-B2 · Oct 25, 2016 · US
Inductor and Coil Substrate
US-2016307691-A1 · Oct 20, 2016 · US
3d pillar inductor
US-2016284789-A1 · Sep 29, 2016 · US
Laminated coil component
US-2016284463-A1 · Sep 29, 2016 · US
Method of manufacturing multilayer ferrite bead
US-2016284467-A1 · Sep 29, 2016 · US
High current, low equivalent series resistance printed circuit board coil for power transfer application
US-2016276095-A1 · Sep 22, 2016 · US
Integrated inductor for integrated circuit devices
US-2016276424-A1 · Sep 22, 2016 · US
Electronic component and method for manufacturing electronic component
US-2016276089-A1 · Sep 22, 2016 · US
Inductors for circuit board through hole structures
US-2016276092-A1 · Sep 22, 2016 · US
System, apparatus, and method for power amplification transformers
US-2016233016-A1 · Aug 11, 2016 · US
Inductor and coil substrate
US-9406432-B2 · Aug 2, 2016 · US
Coil component and method of manufacturing the same
US-2016217905-A1 · Jul 28, 2016 · US
Inductor and method of manufacturing the same
US-2016217910-A1 · Jul 28, 2016 · US
Nested through glass via transformer
US-9384883-B2 · Jul 5, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01F2017/002?
- CPC H01F2017/002 is the Cooperative Patent Classification code for “Details of via holes for interconnecting the layers.”
- How many patents are filed under CPC H01F2017/002 (Details of via holes for interconnecting the layers)?
- Our database includes 890 publications tagged with this CPC code.
- Is patent activity under CPC H01F2017/002 growing?
- Publication counts under this code: 104 in 2024 vs 85 in 2025 (latest complete years).