Method for producing graphene

US9822009B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9822009-B2
Application numberUS-201514947659-A
CountryUS
Kind codeB2
Filing dateNov 20, 2015
Priority dateMay 29, 2013
Publication dateNov 21, 2017
Grant dateNov 21, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A graphene producing method which is capable of increasing a size of each domain of graphene. A plasma CVD film formation device that activates a catalyst metal layer formed on a wafer; modifies the same into an activated catalyst metal layer; decomposes a C 2 H 4 gas as a low reactivity carbon-containing gas by plasma in a space that opposes the wafer; and decomposes a C 2 H 2 gas as a high reactivity carbon-containing gas by heat in the space.

First claim

Opening claim text (preview).

What is claimed is: 1. A graphene producing method, comprising: activating a catalytic metal layer formed on a substrate; supplying and decomposing a low reactivity carbon-containing gas in a space that faces the substrate; and supplying and decomposing a high reactivity carbon-containing gas different from the low reactivity carbon-containing gas, after supplying and decomposing the low reactivity carbon containing gas, in the space that faces the substrate, wherein the low reactivity carbon-containing gas includes at least one of an ethylene gas (a C2H4 gas), a methane gas, an ethane gas, or a propane gas, a propylene gas, a cyclic hydrocarbon gas, an aromatic hydrocarbon gas, a phenol, an alcohol, and ether, and wherein the high reactivity carbon-containing gas includes at least an acetylene gas (a C 2 H 2 gas). 2. The method of claim 1 , wherein, in supplying and decomposing the low reactivity carbon-containing gas, the low reactivity carbon-containing gas is decomposed by plasma. 3. The method of claim 1 , wherein, in supplying and decomposing the high reactivity carbon-containing gas, the high reactivity carbon-containing gas is decomposed by heat. 4. The method of claim 1 , wherein the temperature of the substrate is between 300 degrees C. and 500 degrees C. in supplying and decomposing the low reactivity carbon-containing gas and in supplying and decomposing the high reactivity carbon-containing gas.

Assignees

Inventors

Classifications

  • Nozzles for more than one gas · CPC title

  • Chemistry & Metallurgy · mapped topic

  • Size or surface area · CPC title

  • by activating reactive gas streams before {their} introduction into the reaction chamber, e.g. by {ionisation} or addition of reactive species · CPC title

  • C01B32/186Primary

    by chemical vapour deposition [CVD] · CPC title

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What does patent US9822009B2 cover?
A graphene producing method which is capable of increasing a size of each domain of graphene. A plasma CVD film formation device that activates a catalyst metal layer formed on a wafer; modifies the same into an activated catalyst metal layer; decomposes a C 2 H 4 gas as a low reactivity carbon-containing gas by plasma in a space that opposes the wafer; and decomposes a C 2 H 2 gas as a high …
Who is the assignee on this patent?
Tokyo Electron Ltd
What technology area does this patent fall under?
Primary CPC classification C01B31/0453. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 21 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).