Film capacitor

Patent metadata

Field	Value
Publication number	US-9818540-B2
Application number	US-201514873860-A
Country	US
Kind code	B2
Filing date	Oct 2, 2015
Priority date	Oct 6, 2014
Publication date	Nov 14, 2017
Grant date	Nov 14, 2017

Abstract

A film capacitor includes a stacked body formed by stacking metalized films in each of which a metal electrode is formed on a surface of a dielectric film, at least one of the dielectric films containing a high thermal conductive filler; and external electrodes formed at electrode forming ends provided at opposed positions in the stacked body. The stacked body includes a high thermal conductive portion in which a content of the high thermal conductive filler in the at least one dielectric film is relatively high, and a low thermal conductive portion in which the content of the high thermal conductive filler in the at least one dielectric film is relatively low, or the high thermal conductive filler is not contained. The high thermal conductive portion is provided to continuously extend from an inside of the stacked body to a side portion other than the electrode forming ends.

First claim

What is claimed is:

1. A film capacitor comprising:
a stacked body formed by stacking metalized films in each of which a metal electrode is formed on a surface of a dielectric film, at least one of the dielectric films of the stacked body containing a high thermal conductive filler; and
external electrodes formed at electrode forming ends provided at opposed positions in the stacked body, wherein:
the stacked body includes a high thermal conductive portion in which a content of the high thermal conductive filler in the at least one dielectric film is relatively high, and a low thermal conductive portion in which the content of the high thermal conductive filler in the at least one dielectric film is relatively low, or the high thermal conductive filler is not contained; and
the high thermal conductive portion is provided to continuously extend from an inside of the stacked body to a side portion other than the electrode forming ends, wherein:
the dielectric films of the stacked body include a high thermal conductive film in which the content of the high thermal conductive filler is relatively high and the high thermal conductive filler is disposed in a dispersed manner, and a low thermal conductive film in which the content of the high thermal conductive filler is relatively low and the high thermal conductive filler is disposed in the dispersed manner, or the high thermal conductive filler is not contained; and
the metalized film, in which the metal electrode is formed on a surface of the high thermal conductive film, is stacked at a relatively inner position in a stacking direction, and the metalized film, in which the metal electrode is formed on a surface of the low thermal conductive film, is stacked at a relatively outer position in the stacking direction, so as to form the stacked body.

2. The film capacitor according to claim 1 , wherein the stacked body is formed by superimposing on each other plural pairs of the metalized films in a thickness direction.

3. A film capacitor comprising:
a stacked body formed by stacking metalized films in each of which a metal electrode is formed on a surface of a dielectric film, at least one of the dielectric films of the stacked body containing a high thermal conductive filler; and
external electrodes formed at electrode forming ends provided at opposed positions in the stacked body, wherein:
the stacked body includes a high thermal conductive portion in which a content of the high thermal conductive filler in the at least one dielectric film is relatively high, and a low thermal conductive portion in which the content of the high thermal conductive filler in the at least one dielectric film is relatively low, or the high thermal conductive filler is not contained; and
the high thermal conductive portion is provided to continuously extend from an inside of the stacked body to a side portion other than the electrode forming ends, wherein:
the dielectric films of the stacked body include a high thermal conductive film and a low thermal conductive film;
the high thermal conductive film includes a high thermal conductive region in which the content of the high thermal conductive filler is relatively high, and a low thermal conductive region in which the content of the high thermal conductive filler is relatively low, or the high thermal conductive filler is not contained;
in the high thermal conductive film, the high thermal conductive region is provided to continuously extend from an inside of the high thermal conductive film to an end of the high thermal conductive film, the end corresponding to the side portion other than the electrode forming ends, when seen in a thickness direction of the high thermal conductive film;
in the low thermal conductive film, the content of the high thermal conductive filler is relatively low and the high thermal conductive filler is disposed in a dispersed manner, or the high thermal conductive filler is not contained; and
the metalized film, in which the metal electrode is formed on a surface of the high thermal conductive film, is stacked at a relatively inner position in a stacking direction, and the metalized film, in which the metal electrode is formed on a surface of the low thermal conductive film, is stacked at a relatively outer position in the stacking direction, so as to form the stacked body.

4. The film capacitor according to claim 3 , wherein the stacked body is formed by superimposing on each other plural pairs of the metalized films in a thickness direction.

Assignees

• Toyota Motor Co Ltd

Inventors

• Saito Takahiro

Classifications

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/206 Primary

  inorganic and synthetic material · CPC title

• H01G4/306

  made by thin film techniques · CPC title

• H01G4/18

  of synthetic material, e.g. derivatives of cellulose (H01G4/16 takes precedence) · CPC title

• H01G2/08

  Cooling arrangements; Heating arrangements; Ventilating arrangements · CPC title