Laminate, bonding method, and intermediate product for circuit board
US-12336117-B2 · Jun 17, 2025 · US
for electroless plating (H05K3/4661 takes precedence)
for electroless plating (H05K3/4661 takes precedence) · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/387 |
| Official title | {for electroless plating (H05K3/4661 takes precedence)} |
| Display label | for electroless plating (H05K3/4661 takes precedence) |
| Total patents | 52 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 8 |
| 2016 | 4 |
| 2017 | 9 |
| 2018 | 4 |
| 2019 | 2 |
| 2020 | 5 |
| 2021 | 3 |
| 2022 | 4 |
| 2023 | 5 |
| 2024 | 7 |
| 2025 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Printed circuit board
US-12127343-B2 · Oct 22, 2024 · US
Protection tape for printed circuit board and display device including the same
US-2024300208-A1 · Sep 12, 2024 · US
Method for forming metal layers on glass-containing substrate, and resulting device
US-2024292523-A1 · Aug 29, 2024 · US
Printed wiring board
US-12028988-B2 · Jul 2, 2024 · US
Protection tape for printed circuit board and display device including the same
US-11987031-B2 · May 21, 2024 · US
Wiring body, mounting substrate, wiring-equipped wiring transfer plate, wiring body intermediate material, and method for manufacturing wiring body
US-2024145374-A1 · May 2, 2024 · US
Polymeric composition for use in electroless plating, method of elecroless plating, and polymeric article made by electroless plating
US-2024117170-A1 · Apr 11, 2024 · US
Printed wiring board
US-2023422406-A1 · Dec 28, 2023 · US
Board
US-2023328898-A1 · Oct 12, 2023 · US
Method for manufacturing board with roughened surface and method for manufacturing board having plated layer
US-2023302578-A1 · Sep 28, 2023 · US
Copper clad laminate and method for producing the same
US-2023284393-A1 · Sep 7, 2023 · US
Laminate, bonding method, and intermediate product for circuit board
US-2023018333-A1 · Jan 19, 2023 · US
Layered body, molded article, printed-wiring board and electromagnetic wave shield
US-2022363852-A1 · Nov 17, 2022 · US
Method for producing a printed wiring board
US-11421325-B2 · Aug 23, 2022 · US
Circuit board and method for producing circuit board
US-2022192033-A1 · Jun 16, 2022 · US
Printed circuit board
US-2022132664-A1 · Apr 28, 2022 · US
Method of manufacturing a structure having conductive lines
US-2021329790-A1 · Oct 21, 2021 · US
Protection tape for printed circuit board and display device including the same
US-2021276301-A1 · Sep 9, 2021 · US
Protection tape for printed circuit board and display device including the same
US-11034128-B2 · Jun 15, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/387?
- CPC H05K3/387 is the Cooperative Patent Classification code for “for electroless plating (H05K3/4661 takes precedence).”
- How many patents are filed under CPC H05K3/387 (for electroless plating (H05K3/4661 takes precedence))?
- Our database includes 52 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/387 growing?
- Publication counts under this code: 7 in 2024 vs 1 in 2025 (latest complete years).