Substrate correction device, substrate lamination device, substrate processing system, substrate correction method, substrate processing method, and semiconductor device manufacturing method
US-2024404859-A1 · Dec 5, 2024 · US
US9777403B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9777403-B2 |
| Application number | US-99835709-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 14, 2009 |
| Priority date | Oct 15, 2008 |
| Publication date | Oct 3, 2017 |
| Grant date | Oct 3, 2017 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A single-crystal silicon carbide and a single-crystal silicon carbide wafer of good-quality are disclosed that are low in dislocations, micropipes and other crystal defects and enable high yield and high performance when applied to a device, wherein the ratio of doping element concentrations on opposite sides in the direction of crystal growth of the interface between the seed crystal and the grown crystal is 5 or less and the doping element concentration of the grown crystal in the vicinity of the seed crystal is 2×10 19 cm −3 to 6×10 20 cm −3 .
Opening claim text (preview).
What is claimed is: 1. A single-crystal silicon carbide manufactured by the modified Lely process, comprising: a seed crystal, wherein nitrogen concentration of the seed crystal is greater than 1×10 19 cm −3 ; and a grown crystal grown on the seed crystal, wherein doping element concentration of the grown crystal at least in a region in the vicinity of the seed crystal is 2×10 19 cm −3 to 6×10 20 cm −3 and a ratio of higher to lower doping element concentrations on opposite sides of an interface between the seed crystal and the grown crystal (concentration of high concentration side crystal/concentration of low concentration side crystal) is from 1.05 to 5. 2. A single-crystal silicon carbide according to claim 1 , wherein the region in the vicinity of the seed crystal is a region of 0.5 mm or less thickness on the grown crystal side of the interface between the seed crystal and the grown crystal. 3. A single-crystal silicon carbide according to claim 1 , wherein the ratio of higher to lower doping element concentrations is from 1.05 to 2. 4. A single-crystal silicon carbide according to claim 1 , wherein the ratio of higher to lower doping element concentrations is from 1.05 to 1.5. 5. A single-crystal silicon carbide according to claim 1 , wherein the doping element concentration of the grown crystal in a region in the vicinity of the seed crystal is 5×10 19 cm −3 to 6×10 20 cm −3 . 6. A single-crystal silicon carbide according to claim 1 , wherein the doping element concentration of the grown crystal in a region in the vicinity of the seed crystal is 1×10 20 cm −3 to 6×10 20 cm −3 . 7. A single-crystal silicon carbide according to claim 1 , wherein the doping element is nitrogen. 8. A single-crystal silicon carbide according to claim 1 , wherein the principal polytype is 4H. 9. A single-crystal silicon carbide according to claim 1 , wherein total etch pit density caused by all types of dislocation observed in a wafer of an off-angle of 8° from the {0001} plane made from grown crystal excluding a region in the vicinity of the seed crystal is 1×10 4 cm −2 or less and the micropipe density observed therein is 10 cm −2 or less. 10. A single-crystal silicon carbide according to claim 1 , wherein total etch pit density caused by all types of dislocation observed in a wafer of an off-angle of 8° from the {0001} plane made from grown crystal excluding a region in the vicinity of the seed crystal is 5×10 3 cm −2 or less and the micropipe density observed therein is 5 cm −2 or less. 11. A single-crystal silicon carbide wafer made from grown crystal excluding a region in the vicinity of the seed crystal of the single-crystal silicon carbide according to claim 1 , whose diameter is 75 mm to 300 mm and polytype other than in the edge exclusion region is 4H.
Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title
characterised by the substrate · CPC title
Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth · CPC title
including free carbon or carbide or therewith [not as steel] · CPC title
Carbides · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.