Multi-level micromechanical structure

US9764942B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9764942-B2
Application numberUS-201615147197-A
CountryUS
Kind codeB2
Filing dateMay 5, 2016
Priority dateMay 15, 2015
Publication dateSep 19, 2017
Grant dateSep 19, 2017

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

The present invention relates to a micromechanical device comprising a multi-layer micromechanical structure including only homogenous silicon material. The device layer comprises at least a rotor and at least two stators. At least some of the rotor and at least two stators are at least partially recessed to at least two different depths of recession from a first surface of the device layer and at least some of the rotor and at least two stators are at least partially recessed to at least two different depths of recession from a second surface of the device layer.

First claim

Opening claim text (preview).

The invention claimed is: 1. A micromechanical device, comprising: a device layer comprising only homogenous device wafer material and having a top surface on a first side of the device layer and a bottom surface on a second side of the device layer, wherein the top surface and the bottom surface are on two opposite sides of the device layer, wherein the device layer comprises a multi-level comb structure having at least a rotor and at least two stators, and wherein at least some of the rotor and at least two stators are at least partially recessed to at least two different non-zero depths of recession from the top surface of the device layer and at least some of the rotor and at least two stators are at least partially recessed to at least two different non-zero depths of recession from the bottom surface of the device layer. 2. The micromechanical device according to claim 1 , wherein the rotor and at least two stators comprise a comb structure having a double linear response function, where a change of the output value of a first electrode pair formed by a first stator and the rotor is opposite to a change of the output value of a second electrode pair formed by a second stator and the rotor. 3. The micromechanical device according to claim 1 , wherein an area of linearly changing response functions of a first electrode pair formed by a first stator and the rotor and a second electrode pair formed by a second stator and the rotor is defined by a relative thickness of the respective stator and rotor in the respective electrode pair, and by the amount of vertical overlap between the stator and the rotor in each respective electrode pair in equilibrium position, wherein the relative thicknesses and the vertical overlap of the electrode pairs are defined by the amount of recession of the structures from the first or the bottom surface of the device layer. 4. The micromechanical device according to claim 3 , wherein at least one of the stators and the rotor overlap in an equilibrium position in vertical dimension for an amount that is less than the vertical thickness of a comb finger of the at least one stator and less than the vertical thickness of a comb finger of the rotor. 5. The micromechanical device according to claim 1 , wherein a center part of the rotor is recessed less below at least one surface of the device layer than at least one finger of the rotor recessed below the at least one surface of the device layer. 6. The micromechanical device according to claim 1 , wherein a center part of the rotor is recessed more below at least one surface of the device layer than at least one finger of the rotor recessed below the at least one surface of the device layer.

Assignees

Inventors

Classifications

  • B81B3/0094Primary

    Constitution or structural means for improving or controlling physical properties not provided for in B81B3/0067 - B81B3/0091 · CPC title

  • involving bonding one or several substrates on a non-temporary support, e.g. another substrate · CPC title

  • Accelerometers · CPC title

  • Gyroscopes · CPC title

  • Comb structures · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9764942B2 cover?
The present invention relates to a micromechanical device comprising a multi-layer micromechanical structure including only homogenous silicon material. The device layer comprises at least a rotor and at least two stators. At least some of the rotor and at least two stators are at least partially recessed to at least two different depths of recession from a first surface of the device layer and…
Who is the assignee on this patent?
Murata Manufacturing Co
What technology area does this patent fall under?
Primary CPC classification B81B3/0094. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 19 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).