MEMS process and device

US9756430B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9756430-B2
Application numberUS-201615148375-A
CountryUS
Kind codeB2
Filing dateMay 6, 2016
Priority dateAug 17, 2007
Publication dateSep 5, 2017
Grant dateSep 5, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of fabricating a micro-electrical-mechanical system (MEMS) transducer comprises the steps of forming a membrane on a substrate, and forming a back-volume in the substrate. The step of forming a back-volume in the substrate comprises the steps of forming a first back-volume portion and a second back-volume portion, the first back-volume portion being separated from the second back-volume portion by a step in a sidewall of the back-volume. The cross-sectional area of the second back-volume portion can be made greater than the cross-sectional area of the membrane, thereby enabling the back-volume to be increased without being constrained by the cross-sectional area of the membrane. The back-volume may comprise a third back-volume portion. The third back-volume portion enables the effective diameter of the membrane to be formed more accurately.

First claim

Opening claim text (preview).

What is claimed is: 1. A MEMS transducer comprising: a substrate; at least one membrane formed relative to a first side of the substrate; a back volume formed relative to a second side of the substrate; wherein the back volume comprises a first, second and third back-volume portions. 2. A MEMS transducer as claimed in claim 1 , wherein the first and/or third back-volume portion is separated from the second back-volume portion by a discontinuity in a sidewall of the substrate. 3. A MEMS transducer as claimed in claim 2 , wherein the discontinuity comprises a step in the sidewall of the back volume that separates the first and/or third back volume portions. 4. A MEMS transducer as claimed in claim 3 , wherein the step comprises a discontinuity in the cross-sectional area of the back volume in a plane parallel to the substrate. 5. A MEMS transducer as claimed in claim 2 , wherein the discontinuity comprises a discontinuity in the rate of change of cross-sectional area of the back volume in a plane parallel to the substrate. 6. A MEMS transducer as claimed in claim 3 , wherein the step is curved. 7. A MEMS transducer as claimed in claim 1 , wherein the first and third back-volume portions meet the second back-volume portion in a plane parallel to the substrate. 8. A MEMS transducer as claimed in claim 1 , wherein the second back-volume portion has a greater cross-sectional area than the first and third back-volume portions. 9. A MEMS transducer as claimed in claim 1 , wherein the cross-sectional area of the second back-volume portion is greater than the cross-sectional area of the membrane. 10. A MEMS transducer as claimed in claim 1 , wherein the first and third back-volume portions are separated from the second back-volume portion by a discontinuity in a sidewall of the substrate, and wherein the discontinuity comprises a discontinuity in the cross-sectional area of the back-volume going from the first and third back-volume portions to the second back-volume portion. 11. A MEMS transducer as claimed in claim 1 , wherein the back volume is formed by openings in the substrate, and wherein the shape of the openings may be one or more of: circular, square and rectangular. 12. A MEMS transducer as claimed in claim 1 , wherein at least one of said back-volume portions has a square or rectangular cross-section, and at least one of the back-volume portions has a circular cross-section. 13. A MEMS transducer as claimed in claim 1 , wherein the back-volume comprises more than three back-volume portions. 14. A MEMS transducer as claimed in claim 1 , wherein the third back-volume is directly beneath the membrane. 15. A MEMS transducer as claimed in claim 1 , wherein the third back-volume portion is directly beneath the membrane, the first and third back-volume portions being separated from the second back-volume portion by a discontinuity in a sidewall of the substrate, and wherein the discontinuity comprises a discontinuity in the cross-sectional area of the back-volume going from the first and third back-volume portions to the second back-volume portion. 16. A MEMS transducer comprising: a substrate; at least one membrane formed relative to a first side of the substrate; a back volume formed relative to a second side of the substrate; wherein the back volume comprises a first, second and third back-volume portions, the first and third back-volume portions meeting the second back-volume portion in a plane parallel to the substrate and wherein the second back-volume portion has a greater cross-sectional area than the first and third back-volume portions. 17. A communications device comprising a MEMS transducer as claimed in claim 1 . 18. A package comprising a MEMS transducer as claimed in claim 1 . 19. A package as claimed in claim 18 , wherein the package comprises a lid.

Assignees

Inventors

Classifications

  • Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor {(manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182)} · CPC title

  • B81B3/0021Primary

    Transducers for transforming electrical into mechanical energy or vice versa (dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00) · CPC title

  • Constitution or structural means for improving or controlling physical properties not provided for in B81B3/0067 - B81B3/0091 · CPC title

  • Accelerometers · CPC title

  • Pressure sensors · CPC title

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Frequently asked questions

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What does patent US9756430B2 cover?
A method of fabricating a micro-electrical-mechanical system (MEMS) transducer comprises the steps of forming a membrane on a substrate, and forming a back-volume in the substrate. The step of forming a back-volume in the substrate comprises the steps of forming a first back-volume portion and a second back-volume portion, the first back-volume portion being separated from the second back-volum…
Who is the assignee on this patent?
Cirrus Logic Int Semiconductor Ltd, Cirrus Logic Inc
What technology area does this patent fall under?
Primary CPC classification B81B3/0021. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 05 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).