MEMs device with outgassing shield

Patent metadata

Field	Value
Publication number	US-9764946-B2
Application number	US-201314062157-A
Country	US
Kind code	B2
Filing date	Oct 24, 2013
Priority date	Oct 24, 2013
Publication date	Sep 19, 2017
Grant date	Sep 19, 2017

Abstract

A capped micromachined device has a movable micromachined structure in a first hermetic chamber and one or more interconnections in a second hermetic chamber that is hermetically isolated from the first hermetic chamber, and a barrier layer on its cap where the cap faces the first hermetic chamber, such that the first hermetic chamber is isolated from outgassing from the cap.

First claim

What is claimed is:

1. A capped micromachined device comprising:
a substrate comprising a MEMS device;
a semiconductor cap separated from the substrate by a capping gap;
an inner isolation wall disposed between the substrate and the semiconductor cap and spanning the capping gap, the inner isolation wall and the substrate defining a MEMS chamber enclosing the MEMS device; and
an impermeable to gas shield layer disposed between the semiconductor cap and the MEMS chamber sealing the MEMS chamber from the semiconductor cap to provide a complete outgas barrier between the semiconductor cap and the MEMS chamber.

2. The capped micromachined device of claim 1 , wherein the impermeable to gas shield layer comprises one of titanium nitride, a titanium and titanium nitride combination layer stack, Tungsten, Titanium Tungsten, or a metal silicide.

3. The capped micromachined device of claim 1 , wherein the semiconductor cap comprises an integrated circuit including a plurality of active semiconductor devices.

4. The capped micromachined device of claim 3 , wherein the integrated circuit of the semiconductor cap is configured to process output signals from the MEMS device.

5. The capped micromachined device of claim 3 , further comprising an electrical connection electrically coupling the MEMS device and the integrated circuit, wherein the electrical connection is isolated from the MEMS chamber.

6. The capped micromachined device of claim 1 , wherein the MEMS device comprises one of an accelerometer beam, a gyroscopic structure, or a switch arm.

7. The capped micromachined device of claim 1 , wherein the inner isolation wall includes an outgas sing wall portion, and wherein the impermeable to gas shield layer extends over the outgassing wall portion to seal the MEMS chamber from the outgassing wall portion to provide the complete outgas barrier between the semiconductor cap and the MEMS chamber.

8. The capped micromachined device of claim 1 , wherein the inner isolation wall comprises one of a solder ring or a glass frit.

9. The capped micromachined device of claim 1 , further comprising:
an outer isolation wall defining a gap between the inner and outer isolation walls.

10. The capped micromachined device of claim 1 , further comprising:
an electrical conductor coupled to the MEMS device, wherein the electrical conductor is isolated from the MEMS chamber.

11. A cap for forming a capped micromachined device having a MEMS chamber, the cap comprising:
a cap wafer;
an isolation wall defining a MEMS chamber portion of the cap wafer; and
an impermeable to gas shield layer disposed on at least the MEMS chamber portion of the cap wafer for providing a complete outgas barrier between the cap wafer and the MEMS chamber.

12. The cap of claim 11 , wherein the isolation wall includes an outgassing wall portion, and wherein the impermeable to gas shield layer extends over the outgassing wall portion for providing the complete outgas barrier between the outgas sing wall portion and the MEMS chamber.

13. The cap of claim 11 , wherein the cap wafer comprises an integrated circuit including a plurality of active semiconductor devices.

14. The cap of claim 13 , wherein the integrated circuit includes circuitry to process output signals from the micromachined device.

15. The cap of claim 13 , wherein the cap wafer includes an electrical connection for electrically coupling the integrated circuit to the micromachined device, wherein the electrical connection is outside of the MEMS chamber portion.

16. The cap of claim 11 , wherein the impermeable to gas shield layer comprises one of titanium nitride, a titanium and titanium nitride combination layer stack, Tungsten, Titanium Tungsten, or a metal silicide.

17. A method of fabricating a capped micromachined device comprising:
preparing a cap having an impermeable to gas shield layer on at least a MEMS chamber portion of the cap; and
coupling the cap to a substrate such that (a) an isolation wall spans a capping gap between the cap and the substrate and (b) the cap and the isolation wall define a hermetically-sealed MEMS chamber enclosing a MEMS device on the substrate, the impermeable to gas shield layer sealing the MEMS chamber from the cap so as to provide a complete outgas barrier between the cap and the MEMS chamber.

18. The method of claim 17 , wherein the cap includes the isolation wall, the isolation wall includes an outgassing wall portion, and the impermeable to gas shield layer extends over the outgassing wall portion to provide the complete outgas barrier between the outgassing wall portion and the MEMS chamber.

19. The method of claim 17 , wherein:
the cap comprises an integrated circuit including a plurality of active semiconductor devices and further comprises an electrical connection for electrically coupling the integrated circuit to the MEMS device;
the electrical connection is outside of the MEMS chamber portion; and
coupling the cap to the substrate coupled the electrical connection to the MEMS device.

20. The method of claim 17 , wherein the isolation wall is separate from the cap and the substrate, and wherein coupling the cap to the substrate comprises disposing the isolation wall between the cap and the substrate.

Assignees

• Analog Devices Inc

Inventors

• Chen Li
• Nunan Thomas Kieran
• Yang Kuang L

Classifications

• B81B7/0041 Primary

  maintaining a controlled atmosphere with techniques not provided for in B81B7/0038 · CPC title

• B81B2207/012

  the micromechanical device and the control or processing electronics being separate parts in the same package · CPC title

• B81B3/0094

  Constitution or structural means for improving or controlling physical properties not provided for in B81B3/0067 - B81B3/0091 · CPC title

• B81B2207/095

  through the lid · CPC title

• B81C2203/019

  characterised by the material or arrangement of seals between parts · CPC title