Wafer Processing Method and Apparatus
US-2015214082-A1 · Jul 30, 2015 · US
Bond chuck, methods of bonding, and tool including bond chuck
US9754813B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9754813-B2 |
| Application number | US-201615341769-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 2, 2016 |
| Priority date | Jan 8, 2015 |
| Publication date | Sep 5, 2017 |
| Grant date | Sep 5, 2017 |
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- Title
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Abstract
Official abstract text for this publication.
A bonding chuck is discussed with methods of using the bonding chuck and tools including the bonding chuck. A method includes loading a first wafer on first surface of a first bonding chuck, loading a second wafer on a second bonding chuck, and bonding the first wafer to the second wafer. The first surface is defined at least in part by a first portion of a first spherical surface and a second portion of a second spherical surface. The first spherical surface has a first radius, and the second spherical surface has a second radius. The first radius is less than the second radius.
First claim
Opening claim text (preview).
What is claimed is: 1. A tool comprising: a wafer bonding module comprising: a first wafer bonding chuck having a multi-curvature surface on which a first wafer is to be loaded, the multi-curvature surface being defined at least in part by a first portion of a first spherical surface and a second portion of a second spherical surface, the first spherical surface having a first radius, the second spherical surface having a second radius, the first radius being different from the s…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
- H10P72/0428Primary
Electricity · mapped topic
- H10P72/78Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9754813B2 cover?
- A bonding chuck is discussed with methods of using the bonding chuck and tools including the bonding chuck. A method includes loading a first wafer on first surface of a first bonding chuck, loading a second wafer on a second bonding chuck, and bonding the first wafer to the second wafer. The first surface is defined at least in part by a first portion of a first spherical surface and a second …
- Who is the assignee on this patent?
- Taiwan Semiconductor Mfg Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0428. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 05 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).