Wafer polishing apparatus

Patent metadata

Field	Value
Publication number	US-9744641-B2
Application number	US-201514804513-A
Country	US
Kind code	B2
Filing date	Jul 21, 2015
Priority date	Sep 11, 2014
Publication date	Aug 29, 2017
Grant date	Aug 29, 2017

Abstract

A wafer polishing apparatus includes a lower surface plate, an upper surface plate disposed over the lower surface plate, a carrier disposed between the lower surface plate and the upper surface plate and containing a wafer, and a lift unit lifting the carrier such that an upper surface of the carrier contacts a lower surface of the upper surface plate or lowering the carrier such that a lower surface of the carrier contacts an upper surface of the lower surface plate.

First claim

What is claimed is:

1. A wafer polishing apparatus comprising:
a lower surface plate;
an upper surface plate disposed over the lower surface plate;
a sun gear disposed at a center of the lower surface plate;
an internal gear disposed around the periphery of the lower surface plate;
a carrier disposed between the lower surface plate and the upper surface plate for containing a wafer, the carrier including a gear formed around an outer circumferential surface thereof and engaging with the sun gear and the internal gear; and
a lift unit configured to lift the sun gear and the internal gear such that an upper surface of the carrier contacts a lower surface of the upper surface plate or configured to lower the sun gear and the internal gear such that a lower surface of the carrier contacts an upper surface of the lower surface plate.

2. The wafer polishing apparatus according to claim 1 , wherein the sun gear comprises:
a first pin gear including a plurality of first pins; and
a first support for supporting the plurality of first pins,
wherein the lift unit lifts or lowers the first support.

3. The wafer polishing apparatus according to claim 2 , wherein the internal gear comprises:
a second pin gear including a plurality of second pins; and
a second support for supporting the plurality of second pins,
wherein the lift unit lifts or lowers the second support.

4. The wafer polishing apparatus according to claim 3 , wherein the lift unit concurrently lifts or lowers the first support and the second support.

5. The wafer polishing apparatus according to claim 3 , wherein the internal gear further comprises second support rings projecting from outer circumferential surfaces of the plurality of second pins.

6. The wafer polishing apparatus according to claim 5 , wherein the second support rings are provided at lower ends of the plurality of respective second pins and contact an upper surface of the second support.

7. The wafer polishing apparatus according to claim 5 , wherein the second support rings are provided at outer circumferential surfaces of the plurality of respective second pins between the upper and lower ends of the plurality of respective second pins and are spaced apart from the upper and lower ends of the plurality of respective second pins.

8. The wafer polishing apparatus according to claim 5 , wherein the second support rings provided at the outer circumferential surfaces of two adjacent second pins of the plurality of second pins are spaced apart from each other.

9. The wafer polishing apparatus according to claim 3 , wherein the lift unit comprises:
a first lift part disposed under the first support to lift or lower the first support; and
a second lift part disposed under the second support to lift or lower the second support.

10. The wafer polishing apparatus according to claim 2 , wherein the sun gear further comprises first support rings projecting from outer circumferential surfaces of the plurality of first pins.

11. The wafer polishing apparatus according to claim 10 , wherein the first support rings are provided at lower ends of the plurality of respective first pins and contact an upper surface of the first support.

12. The wafer polishing apparatus according to claim 10 , wherein the first support rings are provided at outer circumferential surfaces between the upper and lower ends of the plurality of respective first pins and are spaced apart from the upper and lower ends of the plurality of respective first pins.

13. The wafer polishing apparatus according to claim 10 , wherein the first support rings provided at the outer circumferential surfaces of two adjacent first pins of the plurality of first pins are spaced apart from each other.

14. The wafer polishing apparatus according to claim 10 , wherein each of the first support rings has a larger outer diameter than a width of the first support.

15. The wafer polishing apparatus according to claim 2 , wherein the lower surface plate includes a center hole, and the first support is disposed in the center hole of the lower surface plate.

16. A wafer polishing apparatus comprising:
a lower surface plate;
an upper surface plate disposed over the lower surface plate;
a sun gear disposed at a center of the lower surface plate;
an internal gear disposed around the periphery of the lower surface plate;
a carrier disposed between the lower surface plate and the upper surface plate and containing a wafer, the carrier including a gear formed around an outer circumferential surface thereof and engaging with the sun gear and the internal gear;
a lift unit configured to lift the sun gear and the internal gear such that an upper surface of the carrier contacts a lower surface of the upper surface plate or configured to lower the sun gear and the internal gear such that a lower surface of the carrier contacts an upper surface of the lower surface plate; and
a control unit to control the lift unit to cause the carrier to be lifted or lowered,
wherein the control unit controls the lift unit to cause a first surface of the carrier to contact one of a first surface of the upper surface plate and a first surface of the lower surface plate in a first polishing operation and to cause a second surface of the carrier to contact the other of the first surface of the upper surface plate and the first surface of the lower surface plate in a second polishing operation.

17. The wafer polishing apparatus according to claim 16 , wherein the control unit controls the lift unit to cause the first surface of the carrier to again contact the one of the first surface of the upper surface plate and the first surface of the lower surface plate in a third polishing operation.

Assignees

• Lg Siltron Inc

Inventors

• Han Kee Yun

Classifications

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B24B37/08

  for double side lapping · CPC title

• B24B37/022

  characterised by the movement of the work between two lapping plates · CPC title

• B24B7/17

  for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders · CPC title

• B24B41/005 Primary

  Feeding or manipulating devices specially adapted to grinding machines (feeding, loading or unloading work specially adapted to lapping machines B24B37/345) · CPC title