Wafer processing method
US-2024395620-A1 · Nov 28, 2024 · US
Feeding or manipulating devices specially adapted to grinding machines (feeding, loading or unloading work specially adapted to lapping machines B24B37/345) · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B24B41/005 |
| Official title | {Feeding or manipulating devices specially adapted to grinding machines (feeding, loading or unloading work specially adapted to lapping machines B24B37/345)} |
| Display label | Feeding or manipulating devices specially adapted to grinding machines (feeding, loading or unloading work specially adapted to lapping machines B24B37/345) |
| Total patents | 296 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 13 |
| 2016 | 17 |
| 2017 | 15 |
| 2018 | 20 |
| 2019 | 35 |
| 2020 | 30 |
| 2021 | 25 |
| 2022 | 35 |
| 2023 | 35 |
| 2024 | 35 |
| 2025 | 31 |
| 2026 | 5 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-2024395620-A1 · Nov 28, 2024 · US
US-2024302817-A1 · Sep 12, 2024 · US
US-10157802-B2 · Dec 18, 2018 · US
US-10150197-B2 · Dec 11, 2018 · US
US-2018339391-A1 · Nov 29, 2018 · US
US-2018333819-A1 · Nov 22, 2018 · US
US-2018292985-A1 · Oct 11, 2018 · US
US-2018264616-A1 · Sep 20, 2018 · US
US-2018264617-A1 · Sep 20, 2018 · US
US-2018236627-A1 · Aug 23, 2018 · US
US-2018229342-A1 · Aug 16, 2018 · US
US-9975213-B2 · May 22, 2018 · US
US-9931730-B2 · Apr 3, 2018 · US
US-2018085887-A1 · Mar 29, 2018 · US
US-9862087-B2 · Jan 9, 2018 · US
US-9839987-B2 · Dec 12, 2017 · US
US-2017348823-A1 · Dec 7, 2017 · US
US-9782866-B1 · Oct 10, 2017 · US
US-9776293-B2 · Oct 3, 2017 · US
US-2017278759-A1 · Sep 28, 2017 · US
Answers are generated from the same data shown on this page.