Method of manufacturing a glass substrate for a magnetic disk and method of manufacturing a magnetic disk

Patent metadata

Field	Value
Publication number	US-9299382-B2
Application number	US-201213359011-A
Country	US
Kind code	B2
Filing date	Jan 26, 2012
Priority date	Jan 27, 2011
Publication date	Mar 29, 2016
Grant date	Mar 29, 2016

Abstract

A method of manufacturing a glass substrate for a magnetic disk includes a polishing step of polishing a main surface of a glass substrate by sandwiching the glass substrate between a pair of surface plates each having a polishing pad on its surface and by supplying a polishing liquid containing polishing abrasive particles between the glass substrate and the polishing pads. In the polishing step, the polishing liquid and each polishing pad are adjusted so that the friction coefficient falls in a range of 0.02 to 0.05.

First claim

What is claimed is:

1. A method of manufacturing a glass substrate for a magnetic disk, comprising:
a polishing step of polishing a main surface of a glass substrate by sandwiching the glass substrate between a pair of surface plates each having a polishing pad on a surface and by supplying a polishing liquid containing polishing abrasive particles between the glass substrate and the polishing pad,
the abrasive particles being colloidal silica,
the polishing liquid being added with a polymer containing a sulfonic group, and
the polishing pad being a polyurethane polishing pad containing an ether group and an ester group and having a lower ether group content than an ester group content;
wherein, in the polishing step, the polishing is carried out by using the polishing pad and the polishing liquid in which a concentration of the polymer is adjusted so that a friction coefficient falls in a range of 0.02 to 0.05 where the friction coefficient is a value obtained by dividing, by a load of 200 g, a frictional force which is measured when the glass substrate is fixed while the polishing pad is rocked in an in-plane direction of the glass substrate at 20 mm/sec in a state where the polishing pad is pressed with the load onto the main surface of the glass substrate and where the polishing liquid is supplied between the glass substrate and the polishing pad,
wherein the polishing pad has as Asker C hardness of 70 or more,
wherein a glass forming the glass substrate is an amorphous aluminosilicate glass,
wherein the surface of the glass substrate after the polishing step has an arithmetic average roughness Ra of 0.15 nm or less,
wherein a content of the polymer containing the sulfonic group in the polishing liquid is in a range of 0.01 to 1 wt %, and
wherein a polishing rate in the polishing step is 0.05 μm/min or higher.

2. The method according to claim 1 , wherein the friction coefficient is adjusted by adding the polymer containing the sulfonic group to the polishing liquid.

3. The method according to claim 1 , wherein the polymer containing the sulfonic group is an acrylic-based polymer containing a sulfonic group.

4. The method according to claim 1 , wherein the colloidal silica has a particle size of 10 to 40 nm.

5. The method according to claim 1 , wherein a pad with one of a suede surface is used as the polishing pad.

6. The method according to claim 5 , wherein a polishing pad with an Asker C hardness of 70 or more and 80 or less is used as the polishing pad.

7. A method of manufacturing a magnetic disk, comprising:
forming at least a magnetic layer on the magnetic disk glass substrate obtained by the method according to claim 1 .

8. The method according to claim 1 , further comprising rotating at least one of said surface plates by a planetary gear.

9. A method of manufacturing a glass substrate for a magnetic disk, comprising:
a pre-polishing step of preliminarily polishing a main surface of the glass substrate by a rough polishing;
a polishing step of polishing said minor surface of the glass substrate by sandwiching the glass substrate between a pair of surface plates each having a polishing pad on a surface and by supplying a polishing liquid containing polishing abrasive particles between the glass substrate and the polishing pad,
the abrasive particles being colloidal silica,
the polishing liquid being added with a polymer containing a sulfonic group, and
the polishing pad being a polyurethane polishing pad containing an ether group and an ester group and having a lower ether group content than an ester group content;
wherein, in the polishing step, the polishing is carried out by using the polishing pad and the polishing liquid in which a concentration of the polymer is adjusted so that a friction coefficient falls in a range of 0.02 to 0.05 where the friction coefficient is a value obtained by dividing, by a load of 200 g, a frictional force which is measured when the glass substrate is fixed while the polishing pad is rocked in an in-plane direction of the glass substrate at 20 mm/sec in a state where the polishing pad is pressed with the load onto the main surface of the glass substrate and where the polishing liquid is supplied between the glass substrate and the polishing pad,
wherein the polishing pad has as Asker C hardness of 70 or more,
wherein a glass forming the glass substrate is an amorphous aluminosilicate glass, and
wherein the surface of the glass substrate after the polishing step has an arithmetic average roughness Ra of 0.15 nm or less,
wherein a content of the polymer containing the sulfonic group in the polishing liquid is in a range of 0.01 to 1 wt %, and
wherein a polishing rate in the polishing step is 0.05 μm/min or higher.

10. The method according to claim 9 , wherein, when the main surface is preliminarily mirror-polished, the friction coefficient between the polishing pad and the glass substrate is adjusted to a range of 0.02 to 0.05.

11. The method according to claim 9 , wherein in the rough polishing step, using a polishing liquid containing cerium oxide as a polisher.

Assignees

• Sakai Hideo
• Tawara Yoshihiro
• Hoya Corp

Inventors

• Sakai Hideo
• Tawara Yoshihiro

Classifications

• B24B37/28

  for double side lapping of plane surfaces · CPC title

• B24B7/228

  for grinding thin, brittle parts, e.g. semiconductors, wafers (grinding edges of thin, brittle parts B24B9/065) · CPC title

• G11B5/8404 Primary

  manufacturing base layers · CPC title