Wafer polishing apparatus
US-9744641-B2 · Aug 29, 2017 · US
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 54867652 |
| Family type | — |
| Earliest priority | Sep 11, 2014 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US9744641B2 — Wafer polishing apparatus |
Best representative member for this family based on priority and filing country.
US9744641B2 — Wafer polishing apparatus (published Aug 29, 2017)
Related publications in this family.
US-9744641-B2 · Aug 29, 2017 · US
US-2016074990-A1 · Mar 17, 2016 · US